during wafer manufacturing
131648
Buddy, U r miscategorized.\nSpecial Education does NOT mean "Super-specialized technical education"\nIt means "Education for children with special needs",or, if u wld understand it this way, "Education for children with Disabilities"\nTry posting ur question in the correct place.
39487
I am not quite sure what the question is. What should the manufacturer do? Did they already do the experiments or do you want to know what sort of experiments to do? Do you want to know how to reduce the data? How to present the data? What statistical tools might be useful?
535922
it is big company produce so many hard ware \nhttp://www.sis.com/products/
393289
Gallium based semi-conductor right now is too expensive to deploy. \n\nIf you want completely out of the left field, I'd go for optical processing.
308330
Because the silicon chip inside is light sensitive, so they need opaque casings to keep from stray light from interfering with the proper operation of the device. Some light sensing chips are made with a clear epoxy body and a molded-in lens.
672207
There are some heat treatments or annealing things they do with plastics that may change its strength.
321464
It may be surface tension.
229706
Send a message to Y answer user "intelligence is sexy"- She is a manager in an injection molding plant, and knows all about this process, and is very helpful. (and gorgeous too, but that's beside the point)
530403
Solid,liquid and gas.
482420
try this http://www.siliconfareast.com/grr.htm
346959
none they work eccentrically in the down phase
156342
Yes. those of frequency higher than infra red are absorbed by the PV. IR travels right through the silicon in the PV
383847
There is usually another step in the process - product readiness - it's a separate group of people / different dept.  Prevents those crazy QA guys and gals from taking over the world :)
67554
In photolithography, first photo resist is added to the surface of the wafer. this photo-resist is then covered with mask for required pattern. This mask can be in contact to the photo-resist or can be a non-contact. present technology uses advanced optical arrangement so that mask can be place with out any contact with the wafer. \n(if contact mask is used then mechanical polishing is required to remove mask)  \nTo remove the photo-resist, different organic agents are used. The choice of chemical agent depends on the type of photo-resist (positive or negative). commonly used chemicals are aceton, methanol, isopropanol. some of the other agents include NMP, glycol ether, amine, DMSO, etc. (search for specific chemical agent for particular photo-resist and semiconductor)\nUsually, wafer is immersed in one of the agents and heated with occasional stirring (manual or ulta-sound). Finally it is rinsed several times with distilled water\n\ngenerally, Plasma is used to ionize the doping agents (usually gases). The ions are then separated using strong magnetic field and electric field is used to accelerate the ions and thus enabling to impinge on the surface of the wafer. the depth of ion penetration depends upon its speed which in turn depends on strength of e-field. (for specific details of viista 8000, check its manual) \n\nHope this helps
93391
cheap labor being used for their industries.
573385
Call the manufacturer.
246036
we are a sourcing and export company based in shanghai ,we are doing pvc films,pe film so i think we can manage bopp for u as well pl email us ur bopp film specifications and we will qoue u lowest price and send u samples ,etnindustries@gmail.com