what is the difference between ic and pcb?
969865
An integrated circuit (IC) is an electronic circuit miniaturized to fit on a small piece of semiconductor material such as silicon. This piece of silicon is encased inside a hermetically sealed plastic, metal, or ceramic package that prevents it being damaged from dust, moisture, and contact with other objects. The package also serves to allow easier connections to a printed circuit board (PCB). The chip inside the IC package is so small that connecting it directly to a PCB would be difficult.\n\nThe purpose of a PCB is to connect ICs and discreet components together to form larger operational curcuits. PCBs may also allow parts to be mounted to them such as card sockets. They are sometimes used as heat sinks for components that generate heat. This is done by making a large copper area then mating the component to the PCB so that it touches the copper area and transfers heat to it.\n\nBefore PCBs, components were connected together with wires, in a scheme called "point-to-point" wiring. It was messy and unreliable when compared to PCBs.
525333
which IC are you referring to? in general microcontrollers run code written in either C or assembly language, so you have to write the program, then compile it. after that you have to program it into the micro. that is done in several ways. some have to be plugged into a device that does it, some can be done through a serial port, and some use a JTAG interface to do it.
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The main circuit board of a microcomputer. The motherboard contains the connectors for attaching additional boards. Typically, the motherboard contains the CPU, BIOS, memory, mass storage interfaces, serial and parallel ports, expansion slots, and all the controllers required to control standard peripheral devices, such as the display screen, keyboard, and disk drive. Collectively, all these chips that reside on the motherboard are known as the motherboard's chipset. ...
586695
Each hardware has its own software interface and supported protocol(s). You have to read manufacturer's documentation.
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FSB = Front Side Bus\nIt is the connection between the CPU, memory, and other system components.\n\nPCI = Peripheral Component Interconnect\nIt is an technology that allows user to expand the functionality of their computer.  It is usually expressed as a "PCI Slot" (the connector on the computer) whereas "PCI cards" deliver the functionality.  For example, there are PCI sound cards, PCI network cards, PCI TV tuner cards, etc.\n\nSATA HDD = Serial Advanced Technology Attachment Hard Disk Drive\nA hard drive that uses serial technology instead of parallel.  On a consumer level, it just means that the connection from the hard drive to the motherboard has changed.  It use to be parallel or PATA.  On an engineering level, the communication isn't sent in parallel fashion (several bits wide but at slow rate) but in a serial fashion (narrow width but at higher rate).\n\nBays = Probably means optical drive bay\nIn computer cases there are references to "bays".  Bays are another means to extend functionality of the computer and they come in two types: 5.25" and 3.5" bays.  5.25" bays can accomodate optical drives such as CDROMS, DVD, CD burners, and other wide products.  3.5" bays were originally designed for floppy drives but can hold anything that can fit in that bay.\n\nDMI = Desktop Management Interface\nMostly used in the workforce.  Allows system administrators to know what kind of software and hard is installed on the computer.\n\nUSB = Universal Serial Bus\nAgain, another expansion technology but is more external compared to PCI technology (which is internal to the computer).  Common uses of USB devices are USB mouse, USB web cameras, USB scanners, USB printers, USB CD burners, etc.
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You can buy kits, I think Maplin do them. Or other electonic hobby shops.\nNot expensive really unless you get into heated etching tanks etc\n\nbassically you buy copper covered boards you then transfer your design to the boards with an etch resistant pen or for a better job using decals.\nThe board is then dipped in an etching solution which removes all the copper not protected.\nThen drill the holes for you components and job done.\nYou can also get 2 sided boards.\nBut multi layer boards isnt a DIY job
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you can easily test an IC by plugging it in a circuit board that works (meaning, other ICs with the same type works there). If you don't have other IC to compare with or don't have the testboard you can test it with a multimeter. See the spec sheet of the IC and try finding out which pins is doing what. And try input something, if the IC outputs correctly as expected, then the IC is ok (beware, don't do this to CMOS IC or any type of IC which is unable to have any of its unused pins is taken off*)\n\n* taken off means if a pin is unused, on some type of IC the pin may be bent so we can use the space below the unused ICs pin to make a connection line. TTL IC is safe to be used for this.
210651
infact the circuitry is so designed that the total power consumption is very small and thats the reason behind making such ICs using the nano technology. these days an IC may comprise millions of transistors allowing u to make the designs smaller and smaller. along with low cost
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They are completely different as it was explained above. But other important difference is that a PLC could accept Analog Signals, Microcontroller is digital.
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Here is a good article on what goes into making a chip and this goes for most memory as well.\n\nhttp://en.wikipedia.org/wiki/Integrated_circuit
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this is very simple. p controller just multiplies the input by some factor. i controller adds the previous control action with the present control action(integration). d controller produces the difference of previous and present control action. a combination of p controller and i controller is a PI controller. similarly for the PD and PID controller.
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there is no difference\nthe basic idea is that all are ethernet cables for ethernet cards\nsome ethernet cables are different \nbut what you looking for is a cable to get your computer conected to a router or a modem\nto be sure just check the way it looks like the entry for the ethernet card and you can figure out easily if that's what you need
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10 pages for two points? Not me.  But, for two points, here's the first two sentences.  :)\n\nBiCMOS technology combines the high input impedence of the MOSFET with the fast switching speed of the bipolar junction transistor (BJT) allowing the fabrication of application-specific integrated circuits (ASICs) suitable for use in high-speed, portable, low-power devices.  The emergence of manufacturers dedicated to proto-type and small-batch wafer fabrication makes the development of highly-customized circuits increasingly feasible.
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This could be a very long answer. Modern ICs begin as a crystal of Silicon (yes, I'm oversimplifying by not mentioning heterogenous material like GaAs, but that's OK).\n\nThese crystals are cut into thin round wafers in a very particular way and polished. These wafers are shipped to a "fab" (short for fabrication line). There, a variety of steps occur. For one, impurity atoms are implanted into the silicon to change certain areas of the wafer's electrical characteristics. Secondly, oxides and other materials are layered on the wafer through "growth" or chemical vapor deposition (there are a few other techniques as well). Lithography is used to control this process. For example, suppose the fab has to "grow" a certain amount of oxide on the wafer. First they will coat the wafer with a light sensitive chemical. Then they will take a "mask" -- a big photographic negative -- and image it on the wafer, exposing the chemical to light. Usually the mask is for only one IC and the wafer will hold many, so a stepper is used to move the mask and make many copies of its image on the wafer. Then the wafer is "developed" which eats away the chemical where the light hit it (or where the light didn't hit it depending on the process used). \n\nOnce this is done, the fab can operate on just the part defined by the mask. So if they put it in an oven for a certain amount of time, the unprotected area will grow an oxide (certain thickness per time). Or they might sputter aluminum on the wafer or use CVD to deposit amorphous polysilicon.\n\nWhen done, a chemical bath strips away the photo chemical (the resist) and the wafer is ready for the next step.\n\nImpurity implantation forms the transistors and resistors on the wafer. A layer of silicon dioxide covers these and has holes etched in it for contacts. Then there is usually a layer of amorphous polysilicon too for other resistors and interconnect wires. Another layer of silicon dioxide is put down and then a layer of alumnimum (or copper in newer chips) form the contact points and the bulk of the interconnecting wires. Also capacitors are formed using plates of aluminum and polysilicon. Then a final passivation layer of silicon dioxide is formed to protect the chip. A lithography step cuts holes in the passivation to allow bond wires to attach.\n\nUsually the wafer is tested at this point and bad chips marked. A machine scores the wafer and cuts it into individual ICs (die at this point). The die are mounted on lead frames and bond wires are attached from the connection points on the die to the lead frames. Finally an epoxy is used to create the actual IC body (the black plastic material). A laser or other means marks the epoxy. The devices are tested and shipped!
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IP68 is a standard that refers to Ingress Protection of a device/connector/enclosure.  It is commonly used to refer to protection from water as well as dust and other contaminants as well.  See the link below to decode the first and second numbers of the rating. \n\nI believe IP is a standard of the IEC.  NEMA also publishes a similar standard for enclosures.
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I would think that microelectronics is just another word for integrated circuit. Now adays the can fit 1 billion transistors on a tiny little chip. ICs are used everywhere now (cars, microwaves, computers, cell phones, etc...).\n\nmore info: http://en.wikipedia.org/wiki/Integrated_circuit
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exactly I am not sure, but a microprocessor(mp) is a very small transistor only capable of doing spcific tasks eith the help of other mp's. while a microcontroller(mc) is capable of handling small functions. The difference lies in the word I used for the performance. A task would be carrying information to another mp for processing. A funtion would be gathering, assessing, transporting, and processing  the same data.