Infineon Technologies AG, based in Munich, Germany, has said that, in order to conduct research into an end-to-end SiP design environment, it is leading the CoSiP project with its partners.
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Infineon leading the CoSiP project
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Mobile selected as site for aircraft manufacturing
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Asymtek announces collaborative effort to support microelectronics packaging and encapsulation research
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International Business Machines assigned patent for instrumenting a compiled software routine for augmentation
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Hilti launches partnership agreement
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Panasonic expanding smartphone business to European market
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International Business Machines assigned patent for intelligent device integration using RFID technology
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Buyers stepping in - STMicroelectronics
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Nokia Siemens introduces open hardware architecture
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Skype cofounders transfer ownership
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Kozio simplifies product development by hardware validation suite
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DEK shows next-generation solar metallization solutions at Shanghai
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Market leading global semiconductor manufacturer expands invoice processing solution
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Toward stem cell pharmacies
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STMicroelectronics adds new front in patent war with InvenSense
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Simmons Simmons elexica > Towards a single, pan-European patent standard
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International business Machines assigned patent for software application recreation