Toshiba Lays Out Plans For Mobile Cell Chip
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Powerful computer processor will be modified for mobile devices.
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Chinese telecom equipment giant ZTE will use Intel's WiMax chips in its development plans.
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Mobile version of Intel Core 2 Extreme is coming soon in high-end gaming notebooks.
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Toshiba has developed software to remotely operate a PC using a mobile phone over a cellular network. The software will be available in cooperation with one of Japan's cellular networks in late March, a Toshiba executive said in a press conference on Tuesday.
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The chip maker has announced a tiny drive that could help bring the power of desktop computers to handheld devices.
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IBM, Sony Corp. and Toshiba Corp. on Monday unveiled some key details on the powerful new &quot;Cell&quot; processor the three are jointly producing to run next-generation computers, game consoles and TVs.
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At the Consumer Electronics Show in Las Vegas, Qualcomm offered a sneak peek of its concept for an ultramobile PC for the largely untapped market where it will meet Intel head on.Qualcomm for the first time demonstrated a prototype of a device reminiscent of Nokia&#39;s N800. Qualcomm calls it a pocketable computer because &quot;if you can&#39;t carry it in your pocket, you can&#39;t carry it with you,&quot; said Sanjay Jha, chief operating officer and president of Qualcomm&#39;s CDMA Technologies Group. The device, which has a slide-out keyboard, runs Windows Mobile, and has HSDPA (High Speed Downlink Packet Access), GPS (Global Positioning Service), Wi-Fi, and Bluetooth.The screen is 800 pixels wide so that most Web sites designed for PCs render nicely, Jha said. That means users could view the regular YouTube.com site, rather than a version of the site designed for mobile phones, he said.The prototype runs on the 7201 chip, a new chip released recently by Qualcomm, but the design is intended to showcase&#160;Qualcomm&#39;s new Snapdragon line of chips. Those chips are now being sampled by hardware vendors, with initial commercial devices expected out this year, he said.Despite the slow take-off of such devices that sit between notebooks and phones -- such as the Samsung Q that runs on Microsoft&#39;s Windows-based ultra-mobile PC platform -- Jha said other factors are finally falling into place to increase their appeal. Faster wireless networks, better processors that require less power and in the near future, the openness of mobile networks and billing plans should increase demand and sales, he said.Still, Qualcomm doesn&#39;t expect that this category of device will approach the widespread adoption of mobile phones. He figures that smartphones make up about 200 million of the entire 1.3 billion handsets on the market. &quot;I think it&#39;s possible to envision a device that sells in that ballpark volume,&quot; Jha said.The chip maker will face Intel in this market, which is also introducing chips for devices that are smaller than laptops but bigger than cell phones. In fact,&#160;Apple is rumored to be developing an ultra-mobile PC product&#160;based on Intel&#39;s processors.&quot;We come at this problem from an understanding of wireless,&quot; Jha said. &quot;Intel comes at it from an understanding of computing. We both bring different things to the table. Time will tell how our vision works versus Intel&#39;s direction.&quot;The companies are also making different bets in terms of wireless network compatibility. &quot;We&#39;re working on WiMax as well but our priority is clearly 3G,&quot; Jha said. Intel, a big backer of WiMax, has said that it may&#160;build WiMax into Menlow, its platform for ultramobile devices, for release some time this year.Nokia&#39;s N800 devices fit into a similar category between a phone and a notebook. Despite the fact that Nokia and Qualcomm are in a bitter licensing dispute, Jha praised the N800, saying it sold more initially than Nokia expected. Nokia has typically declined to reveal sales figures for the devices.Qualcomm doesn&#39;t envision that Snapdragon will only be used in &quot;pocketable computing&quot; devices, the company&#39;s preferred term for what are commonly called ultra-mobile PCs. The chips could be used in navigation devices with wireless connectivity to deliver traffic information to users. Gaming devices, dedicated Internet devices or gadgets like Amazon&#39;s digital book-reader Kindle could also use the chips, Jha said.
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IBM IBM.N, Sony Corp. 6758.T and  Toshiba Corp. 6502.T on Monday revealed their plans for the  powerful new "Cell" processor the three are jointly producing  to run next-generation computers, game consoles and  televisions.
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Consolation prize? Sony today re-iterated its plan to sell its Cell processor chip factory to Toshiba, which will pay Â¥90bn ($835m) for the facility.â¦
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Capacity at Japanese plant to increase 7.5% to meet demand from digital camera, cell phone makers. TOKYO  - Toshiba Corp.
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Toshiba Corp said on Tuesday it would  join a group led by International Business Machines Corp to  develop system chips using 32-nanometre circuitry, as chip  makers increasingly team up to cut development costs.
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IBM, Sony and Toshiba have unveiled, for the first time, some of the key concepts of the highly-anticipated advanced microprocessor, code-named Cell, they are jointly developing for next-generation computing applications and digital consumer electronics.
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Toshiba revealed a new high-performance chip aimed at multimedia applications such as video processing in consumer devices.
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The four companies developing the Cell microprocessor released a few more details about the chip on Monday -- and with them a surprise: first generation versions of the device won't be built on a cutting edge production technology into which the companies have sunk billions of dollars, but on a technology already in widespread use today.
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Toshiba Corp said on Tuesday it would join a group led by International Business Machines Corp to develop system chips using 32-nanometre circuitry, as chip makers increasingly team up to cut development costs.
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Toshiba has joined with an IBM-led research group to extend its work on 32 nanometer chip technology.
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Via Technologies is not likely to ship its supersmall&#160;Mobile ITX motherboard, aimed at ultramobile PCs (UMPCs) and other light portable devices, in production volume until next year, company officials said here at the CES show Monday.The company attracted industry attention when it unveiled the board at Computex in Taipei last June, declaring that it would find its way into markets this year.But &quot;manufacturability issues&quot; will likely prevent the board from being used in commercially launched devices this year, according to Alp Sezen, a sales director for Via based in Fremont, California. Via expects to announce the Mobile ITX production schedule at this year&#39;s Computex, and will probably just manage to ship sample boards by the end of the fourth quarter, he said.&quot;It&#39;s normal to take about a year between announcing a board to production,&quot; he said. He acknowledged, however, that ultimately in the case of the Mobile ITX, the time between its unveiling and production is going to be more than 18 months.Like prototypes running last year, current Mobile ITX boards use 1GHZ CZ-M ULV (ultra low voltage processors) and CX700 chip sets. The board measures 7.5 centimeters by 4.5 cm -- smaller than a credit card -- and to get it that small, the spaces between the pins underneath the processor need to be shrunk to 0.5 millimeters from the current 1.0 millimeters in the company&#39;s current Pico ITX board, Sezen said.It&#39;s not easy to do this and ensure more than 90 percent of the boards coming off production lines are error free, Sezen said.Chip packaging technology needs to improve, he added. Via is a fabless chip developer and, on its own, faces difficulties developing new, cost-effective packaging technologies.In a sense, Via is dependent on Intel ramping up volume of new generation, 45-nanometer process chips. As Intel does so, new surface-mount technology for chips will be developed that can also be used to manufacture the Via Mobile ITX boards.Although the Mobile ITX is not likely to appear in UMPCs and other light portable devices until next year, the reduced package chip set incorporated into the board will likely be used in com modules for embedded systems by the end of this year, Sezen said. A manufacturer for these embedded systems is likely to make a public announcement this month, he said.Some would-be makers of new lightweight mobile devices, however, are chomping at the bit to get their hands on the new Via board. The MTube project, a research and development project sponsored by the Taiwan government&#39;s Science and Technology Group (STAG), was showing off a Linux-based, prototype Mobile Internet Device (MID) that incorporates the Mobile ITX board and measures 3.3 by 3.3 by 0.8 inches. It sported a 2.8-inch VGA touch screen and supports full rate video playback.The project wants to spin off from STAG and deliver a commercially available product as soon as it can get its hands on a motherboad with the specs that would make it viable, according to H.T. Kung, the project&#39;s advisor. However, to date, neither Via nor Intel could promise to deliver a commercially usable board within that timeframe, he said.&#160;