In Brief: Infineon opens $1B chip plant in Malaysia
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(InfoWorld) - Infineon Technologies has opened its first chip plant in Asia, a $1 billion facility located in Kulim, Malaysia. The Kulim plant will produce power and logic chips used in automotive and industrial applications, Infineon said. The factory will use 200-millimeter wafers to produce these chips, one generation behind the 300-millimeter wafers used by the most advanced chip plants currently in operation. The Kulim plant will have a monthly production capacity of 100,000 wafers and employ a staff of 1,700 when production reaches full capacity, Infineon said. The products that will be produced at Kulim include Infineon's CoolMOS and Smart-Power chips. CoolMOS chips are used in power supplies for PCs and servers as well as in mobile-phone battery chargers to improve power efficiency and reduce heat, Infineon said. The Smart-Power chips are used in automotive applications, finding their way into a range of systems, including anti-lock brakes and airbags.
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Chip maker likely is making way for new products.
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Semiconductor Manufacturing International Corp. (SMIC), China&#39;s largest chip maker, has signed a deal to license a 45-nanometer (nm) manufacturing process from IBM, the company said Wednesday.The licensing agreement gives SMIC rights to use IBM&#39;s 45nm bulk CMOS (complementary metal-oxide semiconductor) process technology, the Chinese chip maker said in a statement. That number refers to the average size of the smallest features that can be created on a chip, and smaller is generally considered better.The 45nm process licensed by SMIC will allow the company to produce sophisticated communication chips, such as 3G (third-generation) mobile chip sets, as well as chips for graphics and consumer applications, the statement said.At present, 45nm technology is the most advanced process available for commercial semiconductor production, and chip makers are just starting to use the technology. Terms of the deal, which helps SMIC keep pace with the 45nm efforts of rival contract chip makers, were not disclosed.
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By Nurrulmuna Mohd Ali  ENERGY, Water and Communications Minister Datuk Seri Dr Lim Keng Yaik launched the Malaysia Internet Exchange (MyIX) last Friday at Shangri-La Hotel, Kuala Lumpur.
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The Intel Corporation has received approval to build a $2.5 billion chip plant in China amid the countryâs booming demand for chips used in personal computers and cellphones. The factory is planned for the northeastern city of Dalian, according to the cabinetâs National Development and Reform Commission, the countryâs top economic planning agency. Intel officials in Beijing and at the company headquarters in Santa Clara, Calif., declined to comment, saying no formal announcement had been made.
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MICRON Technology, the worldâs number two maker of computer memory chips, is planning to build its first plant in China by 2005.
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InfoWorld - Semiconductor Manufacturing International Corp. (SMIC), China's largest chip maker, has signed a deal to license a 45-nanometer (nm) manufacturing process from IBM, the company said Wednesday.
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Infineon Technologies AG today said it would build a new front-end production plant in Kulim High Tech Park, Malaysia, at a cost of $1 billion.
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Infineon Technologies will build a fab in Kulim High Tech Park, Malaysia, to produce power supply and logic chips used in cars and industrial power applications, the firm announced on December 8. Infineon
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Intel Corp. INTC.O will make   chips with four processing cores in November the world's   biggest microchip maker said on Tuesday as it tries to maintain   a lead over rival Advanced Micro Devices Inc.AMD.N.
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Chipmaker announces new chipset and reference design for consumer devices and PCs.
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Germany&#39;s Infineon Technologies AG, one of Europe&#39;s largest chip makers, said Wednesday that it is spending $1 billion to build a production plant in Malaysia.
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Infineon on Wednesday said it would invest $1bn in a new semiconductor plant in Malaysia as it stepped up production of chips used in automotive and industrial power applications.
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The company is in the midst of making the first samples of the 45-nanometer chip, expected to come out toward the end of next year.
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Infineon Technologies AG, Europe&#39;s second-largest maker of semiconductors, plans to invest about $1 billion in a new factory in Malaysia to expand its automotive chip business and be closer to customers in the region.
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Intel on Thursday is expected to open a new factory to accelerate the production of chips using a 45-nanometer manufacturing process, slated to be used for its&#160;upcoming Penryn chips.The &#39;Fab 32&#39; in Chandler, Arizona, will use the&#160;45nm manufacturing process&#160;to produce chips for servers, PCs, mobile phones, and consumer devices, according to Intel.&quot;The opening of this fab means that we&#39;ve now moved into high-volume production of our 45nm chips,&quot; said Kari Aakre, an Intel spokeswoman. Intel&#39;s been making 45nm chips for a year now in a development fab in Hillsboro, Oregon, which isn&#39;t high-volume, Aakre said.Intel President and CEO Paul Otellini said last month that Intel plans to introduce 15 new 45nm processors by the end of the year and 20 in the first quarter of 2008. Penryn chips for servers and workstations will be introduced on Nov. 12.Intel will also use the 45nm manufacturing process for Silverthorne, a low-power Intel architecture designed for ultramobile devices, mobile Internet devices and low-cost PCs. Silverthorne chips will appear early next year.Next year it will add factories in Kiryat Gal, Israel and Rio Rancho, New Mexico, to produce 45nm chips. The new fabs will help Intel meet its projection to ship more 45nm chips than 65-nm chips by the third quarter of 2008, Aakre said.Intel currently ships 65nm chips, and Penryn is the code name given to the 45nm &quot;shrink&quot; of Intel&#39;s current chip designs. The measurements refer to the size of the features on the silicon chip.Penryn&#39;s successor, the 32nm &#39;Nehalem&#39; processor, will appear in 2009. At Intel Developer Forum in San Francisco last month, Otellini demonstrated Nehalem, saying it would deliver better performance-per-watt and better system performance through its QuickPath Interconnect system architecture. Nehalem chips will also include an integrated memory controller and improved communication links between system components.