Update: AMD, IBM Announce New Power-Saving Tech
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AMD and IBM said Monday that they had developed a new strained-silicon process that offers more performance at the same power levels, a technology that will enter production in mid-2005.
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US chipmaker AMD on Monday introduced a faster mobile chip, Athlon 64 processor 3000+, for thin and light notebook computers. The new chip enables a powerful 32-bit computing
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(InfoWorld) - As Intel Corp. and Advanced Micro Devices Inc. (AMD) race toward smaller, faster chips, the fierce competition is taking its toll as both companies struggle to maintain profit margins by using more efficient manufacturing. At the tiny scale of 45-nanometer transistors and wires, a single speck of dust on a 300-millimeter silicon wafer can destroy an entire processor. Lower manufacturing yields cut into a company's profit margin, reducing the number of functional chips they can sell from each wafer. "As an industry, we're running out of gas at 45-nanometer geometry," said Nick Kepler, vice president of logic technology development for AMD. "We've been unable to scale the size as much as we used to because of leakage. We're still putting transistors closer together, but not shrinking the gates. So geometry shrinks can hurt you now, which they haven't in the past." One problem is that 65-nm and 45-nm chip components have shrunk so far that they are now smaller than the wavelength of the light used to carve those features onto silicon chips. To fight that trend,Â AMD and IBM Corp. said they will use three new technologies to boost manufacturing efficiency. By the second half of 2008, AMD expects to be producing 45-nm chips using immersion lithography, ultra-low-k interconnect dielectrics, and enhanced transistor strain. The companies made the announcement at the International Electron Device Meeting in San Francisco. By inserting liquid instead of air between the projection lens and the wafer, AMD and IBM can reduce the wavelength of the light, giving them a 40 percent gain in resolution compared to dry lithography and allowing them to sell a higher percentage of the hundreds of chips on every wafer, Kepler said. Likewise, IBM plans to produce 65-nm server chips by the second half of 2007, then shrink both server and gaming chips to 45-nm at some point in the future, said Gary Patton, vice president of technology development for IBM's semiconductor research and development center. AMD and IBM have cooperated on chip development since 2003, and last year extended their contract through 2011 to reach the 32-nm and 22-nm chip generations. In response, Intel says that it beat AMD to the market with 65-nm chip sales by more than a year, andÂ has already begun producing samples of its 45-nm "Penryn" quad-core chipÂ for notebooks, desktops and servers. Intel plans to ship those chips in the second half of 2007. Even if AMD improves its manufacturing, Intel is poised to continue its lead in shrinking chip geometries because it has shorter gate lengths and SRAM (static RAM) cell sizes, said Rob Willoner, a technology analyst with Intel's technology and manufacturing group. "People have different meanings when they talk about the 65-nm process. There's not an industry standard," he said. AMD's Opteron chip was a commercial success because its excellent design compensated for poor dimensions at the 90-nm scale, he said. Chips with a greater cache of local memory stored in SRAM cells can avoid the time-intensive process of retrieving data from external sources. At the same conference in San Francisco this week, Intel announced plans to use "floating-body cells" to further increase the amount of on-chip memory, according to published reports. Despite the manufacturing challenges, chip companies continue to build smaller features because of the tremendous performance benefits. By shrinking from 90 nm to 65 nm, Intel chips have double the transistor density while reducing leakage five-fold (at constant performance) and requiring 30 percent less switching power. Â
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MIT researchers have developed a new ultralow-voltage chip that could improve the energy efficiency of low-power electronics tenfold.
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(InfoWorld) - IBM researchers are counting on a 40-year-old technology to keep modern, state-of-the-art datacenters running cool and allow companies to squeeze more computing power from the electricity they consume. These considerations are more important than ever. The power consumed by a rack of servers has risen from around 5 kilowatts (kW) of power per server rack five years ago to as much as 30 kW today, thanks to the introduction of more powerful processors and denser blade servers. And the power-consumption levels will continue rising in the years ahead. "People want more compute power and we can give it to them because we can package this into a smaller footprint, basically," said Roger Schmidt, chief thermal architect and distinguished engineer at IBM's Server and Workstation Division. The challenge that Schmidt and his colleagues face is how to dissipate the increasing levels of heat these systems generate. "We're working on this all the way from the chip to the datacenter," he said. At the datacenter level, Schmidt sees an expanded role for water cooling as a means to bring heat levels down. Water cooling, which uses small pipes filled with distilled or deionized water to dissipate heat, was first used by IBM to cool mainframe computers during the 1960s. The technology, which was used in more than 90 percent of mainframes by the mid-1980s, was given a second lease on life in 2005, when IBM introduced its line of Cool Blue water-cooling products. One such product is IBM's $4,299 Rear Door Heat eXchanger, which attaches to the rear of a server rack. Four inches thick and weighing about 32 kilograms (70 pounds) when filled with water, the Rear Door Heat eXchanger, can absorb more than half of the heat coming from a server rack, according to IBM. IBM's water-cooling systems, as well asÂ competing products from companies like Hewlett-Packard, offer several benefits for datacenters. Most importantly, water can absorb more heat than air, and the pumps required to circulate water in a cooling system consume less power than air-conditioning systems. And IBM plans to expand its line of water-cooling products in the months ahead. "We've got other enhancements coming out shortly," Schmidt said, declining to elaborate on specific details. One potential enhancement is to extend water cooling from the rear of the server rack to specific components, such as processors -- as was done with some IBM mainframes. "Once you bring water to the rack, you've got a lot of options," Schmidt said. Convincing datacenter operators to pipe water through racks filled with expensive servers and invaluable data is not always easy. The easiest to convince are those IT managers with experience from the days when water-cooled mainframes were the backbone of large corporations, Schmidt said. But many remain nervous at the thought of water-filled pipes coursing through rooms filled with expensive servers and invaluable data -- even though water is already a key component of all datacenters. "Water cooling in datacenters is already there," Schmidt said. "The chilled water that's brought to the air conditioning units? That's water and it's in the pipes right above the server racks. We're just plugging into that to apply that at the rack level."
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Technical details of the new low-power mobile CPU, expected to ship this year, are being released at a chip conference this week.
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AMD and IBM announced a collaborative breakthrough in processor technology today, marking the first use of two new techniques that advance speed and performance without requiring more power.
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AMD and IBM have developed a strained silicon transistor technology which the firms believe will dramatically increase processor performance.
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AMD has introduced the latest additions to the company's Opteron line, boosting performance of the multi-processor power plants for X86 servers and workstations.
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Thanks to a new &#39;Dual Stress Liner&#39; strained silicon manufacturing technique, AMD and IBM today announced that new Athlon64 and Power processors, set to debut in early 2005, could offer a performance boost of up to 24 percent.
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(InfoWorld) - A group of some of the biggest technology companies said they've committed to a plan to improve the power efficiency of equipment they make and use. The Climate Savers Computing Initiative , which includes companies such as Google Inc., Microsoft Corp., Intel Corp., Hewlett-Packard Co., Dell Inc. and Sun Microsystems Inc., aims to improve the efficiency of power sources for computers and servers and encourage end users to take advantage of underused power management techniques. Only about 50 percent of the power that leaves a power outlet reaches a PC, because inefficient power cords leak energy, Google's Senior Vice President of Operations, Urs Holzle said Tuesday during a press conference to announce the program. Climate Savers has defined a series of standards for power supply efficiency in servers and PCs that it suggests members adopt between now and July 2010. By 2010, the Climate Savers standard will define a power supply that is above 95 percent efficient, Holzle said. The program asks manufacturing members to build products to the standard and companies to pledge to buy products that have the improved power supplies. The improvement doesn't require the development of new technologies. "This is all do-able today with technology we have and know," Holzle said. The reason that vendors haven't deployed such efficient power cords is because they cost more, said Pat Gelsinger, senior vice president and general manager of Intel's digital enterprise group. A PC with a more efficient power cord would cost around US$20 more and a server an additional $30, he said. To address that price premium, Climate Savers is encouraging energy companies to issue rebates to users that buy products with the more efficient power supplies. Over time that cost premium is expected to drop with volume production, Gelsinger said. In addition, end users will save on their energy bills, also helping to offset the cost, he noted. Another component of Climate Savers is general education and encouragement for end users to take advantage of power management mechanisms that are typically built into existing PCs. "Ninety percent of PCs are capable but aren't utilizing power management techniques," Gelsinger said. "We want to drive IT policy in enterprises," he said. Improving power supply efficiencies and the use of power management techniques along the timeline Climate Savers has described would reduce global carbon emissions from the operation of computers by 54 million tons per year. It would save 62 billion kilowatt hours of energy in 2010, worth around $5.5 billion in energy costs, the group said. In its own data centers, most of Google's servers already have power supplies that comply with the Climate Savers standards for 2008 and 2009, Holzle said. Google began investing in the more expensive supplies because "it's worth spending a bit more on the power supply to save on the energy bill," he said. He defended Google's overall carbon footprint, despite questions about company jets that are hard on the environment. He pointed to the solar power used at the company's headquarters and incentives for employees to buy hybrid cars. In addition, he hinted at future energy-saving programs that the company plans to announce soon. Although Holzle said he knows Google's carbon footprint, he declined to share it. Other companies that are already part of the program include Yahoo Inc., Hitachi Ltd., eBay Inc., Advanced Micro Devices Inc., NEC Corp., Red Hat Inc., Lenovo Group Ltd., Unisys Corp. and the Linux Foundation.
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IBM and Advanced Micro Devices (AMD) have jointly developed a new method for implementing strained silicon technology on both positive and negative transistors, the companies are expected to announce today.
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IBM announced yesterday it has officially begun production of the 65nm version of the revolutionary successor to the Power CPU, which now powers some BladeCenter servers and, of course, Sony's PlayStation 3. To lower power consumption while at the same time reducing current leakage, IBM found itself adopting a novel approach, as the company itself shamelessly admitted.
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An AMD study has revealed changes in global data center energy use.
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DECEMBER 13, 2004 (IDG NEWS SERVICE) - IBM and Advanced Micro Devices Inc. announced today that they have jointly developed a new method for implementing strained silicon technology on both positive and negative transistors.
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Processors will be faster and use less power, add new multimedia features.
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Advanced Micro DevicesÂ (AMD) has developed a low-power chip that it thinks will make portable video players more compelling by reducing the time needed to transfer content to the devices. The company is expected to announce the chip at the International Consumer Electronics Show (CES) Monday.