IBM and MediaTek Work on Ultrafast Wireless Chips
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Sitting on your living room couch, you press the link on your mobile device for a new high-definition movie. Almost instantly, the movie is transmitted and begins to play. That vision of the future moved a bit closer Sunday, when IBM and MediaTek announced a joint initiative to develop ultrafast wireless chipsets for use in homes and offices.
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IBM Corp. and Taiwanese chip designer MediaTek Inc. on Monday announced a three-year pact to develop wireless chipsets for a new technology to transmit large volumes of information, such as full-length high definition (HD) movies, between DVD players, HD-TVs, hand-held devices or other gadgets around the home or office.
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The $1.99 software needed to unlock fast Wi-Fi chips shipped with Macs last year is released, along with a new access point.
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(InfoWorld) - Sierra Wireless will provide embedded wide-area wireless modules to a new Intel ultra mobile PC (UMPC) platform that enabling devices to hook up to 3G (third generation) wireless telecommunications, creating a new way to use a UMPC. Until now, UMPCs from most companies, includingÂ Samsung Electronics and Asustek Computer, have included two wireless functions, WLAN (wireless LAN) for wireless Internet connections in a home, office, or other location near a Wi-Fi hot spot, and Bluetooth. Few other UMPCs, save Sony's Vaio VGN-UX50, which offers Cingular EDGE (Enhanced Data GSM Environment) WAN capabilities, provide a way to connect to the Internet away from civilization. The wireless modules from Sierra, a Vancouver, British Columbia chip designer, will allow users to remain connected far out in the field, and lead to the development of many innovative, new UMPC devices, the company said. Intel plans to make itsÂ ultra mobile PC chip kitÂ available in the first half of next year, the company said at the Intel Developer Forum, which ended Thursday. The company said the microprocessors in the platform will consume just half the power of ones used in current UMPCs, and will be 25 percent smaller. The chip kit is designed to allow developers to make smaller, cooler running UMPCs with longer battery life and new possible uses, Intel said. The UMPC, code-named Origami earlier this year, is a new breed of handheld deviceÂ promoted by Microsoft and IntelÂ aimed at users requiring more PC-like functions and larger screens in a carry-around device. It falls somewhere between a tablet PC and a PDA in size, and runs on the Windows XP Tablet Edition OS. One of the first such devices was viewed by users at the Cebit electronics show in Germany early this year,Â Samsung's Q1. The device was running on a 900MHz Intel Celeron microprocessor and boasted 500MB of RAM.
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German electronics manufacturer Siemens has set what it claims to be the fastest-ever wireless connection.
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Next week, the Wi-Fi Alliance will release Wi-Fi Multimedia, or WMM, an interim standard that will provide early quality-of-service functionality for multimedia equipment based on the emerging 802.
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Both companies plan to start offering the super-speedy, cost-effective wireless technology as soon as possible.
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Chip designer Alereon Inc. said Monday it is releasing the first chip that uses a frequency band that is legal all over the world for wireless USB, a technology with the potential to cut the tangle of cables surrounding computers.
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A group of major wireless operators, device and infrastructure vendors Tuesday released a proposed specification that the group claims will enable devices to seamlessly transition between cellular and wireless data networks.
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Intel announced on Thursday a component that&#39;s compatible with all Wi-Fi standards, which will let the chipmaker reach the full audience of individuals seeking to be wirelessly connected.
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A new inkjet-printed technology enables a different kind of wireless connectivity between devices.
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A future version of Bluetooth will allow connections to hop on Wi-Fi networks when additional bandwidth is required.
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Upcoming chip set will support 802.11a, b, and g networks.
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An emerging long-range,  high-speed wireless technology is expected to spread quickly  and be available globally within two years, a key backer of the  so-called WiMax technology said on Tuesday.
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Technology that can converge different wireless gadgets into a single device is discussed at a conference.
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Prototype 90-nanometer radio chip promises more power than current CMOS technology.
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Companies at CES debuting cheaper 802.11n gear, plus options for adding the faster standard without getting rid of your existing equipment.