AMD, IBM Collaborate on New Chip Technologies
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AMD and IBM announced a collaborative breakthrough in processor technology today, marking the first use of two new techniques that advance speed and performance without requiring more power.
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Advanced Micro Devices Inc. (AMD) plans to develop flash memory chips that blend the best characteristics of the two dominant flash memory architectures, the company announced.
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AMD and IBM said today they will begin using a strained-silicon transistor technology designed to augment processor performance and power efficiency.
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IBM  and Taiwan's top chip design  firm Mediatek Inc  said on Monday they are jointly  launching a research and development project to develop  ultra-fast chipsets to tap into growth in the consumer market.
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Advanced Micro Devices Inc. AMD.N,   the world's number two maker of microchips for personal   computers, has sealed a deal to supply China's second-largest   PC maker with chips, scoring its latest victory in a market   share battle with bigger rival Intel INTC.O.
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IBM and chip design firm Mediatek are collaborating on ultra-fast chip sets for the consumer market.
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A new semiconductor alloy jointly developed by IBM and its partners will spur the development of faster and smaller memory chips. The companies say the advancements would lead to smaller chips than currently possible with flash memory.
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Advanced Micro Devices Inc. AMD.N,   the world's number two maker of microchips for personal   computers, will supply China's second-largest PC maker with   chips, scoring its latest victory in a market share battle with   bigger rival Intel INTC.O.
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IBM Corp. and Advanced Micro Devices Inc. (AMD) have tacked a three-year extension onto their December 2002 collaboration agreement that could see the two companies work on chip-making technologies based on a 32 nanometer process. The agreement was set to expire at the end of 2005, but now extends until Dec. 31, 2008.
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Advanced Micro Devices and Intel are vying to be the first to create a new generation of chips with four processing cores.
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In dueling announcements, Intel Corp. and IBM separately say they have solved a puzzle perplexing the semiconductor industry about how to reduce energy loss in microchip transistors
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By Rodney Tanaka, San Gabriel Valley Tribune, Calif.  Dec. 13--PASADENA -- A local tech company is partnering with IBM to build  chips used in digital cameras and X-ray machines.
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TechWeb - IBM works with Microsoft and other application vendors to expand the use of its hardware in computer clusters and mainframes.
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It looks like a partnership between AMD, IBM, Sony and Toshiba has produced a new technology which allows faster transistor speeds with the same energy consumption.
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Both AMD and Intel are working on plans to integrate graphics-processing capabilities onto the same chip as the central processing unit (CPU), which could help deliver ultra-powerful chips as early as 2008.
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A FILING WITH the Securities and Exchange Commission shows that AMD has extended its existing deal with IBM. According to Investors.
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(InfoWorld) - IBM will work with the German chemical company BASF Group to produce a new generation of chips with feature sizes of 32 nanometers, the companies said Friday. The partnership will produce chips scheduled to reach the market in 2010, IBM said. Chips with circuits and other features of 32nm use less electricity and have smaller dimensions than chips built with 45nm or 60nm, allowing vendors of smartphones, notebook PCs, and other electronics to pack more processing power in their products. The two companies hope to create an improved approach to using chemicals in lithography, a method of manufacturing chips by stacking layers of different materials like a cake, then etching away part of each layer to create the tiny components of a microprocessor. Work will begin immediately at IBM's facility in Yorktown Heights, New York, and at BASF's headquarters in Ludwigshafen, Germany, said Ronald Goldblatt, a distinguished engineer and senior manager at IBM Research. BASF already supplies chemicals to many chipmakers, but under the new partnership it will also share its employees and expertise with IBM. Each company will play to its strengths, with most of the synthesis and testing happening at BASF, while prototyping and application work at IBM, Goldblatt said. He declined to comment on whether the deal involved any exchange of money. IBM plans to use the new chemicals across its entire range of products, which include itsÂ Power6 high-end server chipÂ announced on May 21, a variety of ASICs for telephony backbone platforms, and itsÂ Cell Broadband Engine chipÂ used to process high-end graphics data in gaming consoles, including Sony Computer Entertainment's PlayStation 3, Microsoft's Xbox 360, and Nintendo's Wii. The BASF deal marks an expansion of IBM's strategy of collaborating with partners to design new chips instead of doing all the work itself. IBM used the same approach when it created the Cell chip by collaborating with Sony and Toshiba. And on May 23,Â IBM said it would collaborateÂ with a larger group of chipmakers on 32nm semiconductor production technologies. That group includes Chartered Semiconductor Manufacturing, Freescale Semiconductor, Infineon Technologies, and Samsung Electronics. IBM is also using the new deal to ratchet up competition with Intel, which plans to bring its own 32nm architecture chips to market by 2009. The two companies have been locked in an increasingly public race to design faster chips since they both picked the same day in January to issue news releases about advances in "high-k metal gate" technology. That approach employs rare materials to construct smaller, more efficient transistors than the silicon dioxide used in modern chips. Intel insists it leads the industry in that race, with plans to use the new technique to launch its 45nm "Penryn" chip in the fourth quarter of 2007, while IBM and its partner Advanced Micro Devices don't plan to sell 45nm chips until the middle of 2008. Texas Instruments entered the contest as well on June 13, announcing a plan to use high-k materials in 45nm chips, also beginning production in the middle of 2008.