Update: AMD, IBM Announce New Power-Saving Tech
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AMD and IBM said Monday that they had developed a new strained-silicon process that offers more performance at the same power levels, a technology that will enter production in mid-2005.
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Computers with AMD&#39;s Opteron processor will soon be able to take advantage of the same power management technology the company has already built into its laptop and desktop microchips.
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IBM has boosted the power efficiency of its PowerPC 750CL and PowerPC 970GX chips, part of a bid to reach a wider range of enterprise and consumer applications.
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Advanced Micro Devices (AMD) and International Business Machines (IBM) have developed a new technology that they claim will deliver higher performance margins, from their latest microprocessors, with dual stress liner technology.
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IBM's new chip works in 64-processor servers and contains features to let users cap system power consumption.
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New high-end dual-core Opterons will power servers.
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Advanced Micro Devices plans to demonstrate its version of a new approach to processor design on Tuesday, with a chip that is expected to offer faster computing and relatively less power consumption.
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Engineers from IBM, AMD, Sony and Toshiba have developed a strained silicon transistor technology aimed at improving processor performance and power efficiency with up to a 24 percent transistor speed increase.
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IBM improves the power efficiency on 750CL and 970GX processors, plans even more efficient chips.
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AMD and IBM announced a collaborative breakthrough in processor technology today, marking the first use of two new techniques that advance speed and performance without requiring more power.
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An innovative new memory technology that promises to replace flash in a wide range of products has been unveiled by IBM and two partners who claim their phase-change technology is 500 times faster than flash and draws roughly half the power.
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(InfoWorld) - IBM has improved the power efficiency of two models of PowerPC processors, making an effort to strengthen its position in markets from cars and printers to networking and communications equipment. The PowerPC 750CL and PowerPC 970GX are both single-core chips built with a 90-nanometer process. Both chips reduce DC electricity leakage with thicker gate oxides and reduce AC switching power with higher thresholds, the company said. IBM made the change to reach a wider range of enterprise and consumer applications, said Ron Martino, director of Power Architecture Solutions in IBM's Technology Collaboration Solutions unit. The company already has a strong grip on certain sectors. It makes the processors for all three of the top gaming consoles: Sony Computer Entertainment's PlayStation 3, Microsoft's Xbox 360, and Nintendo's Wii. These improved chips could help it reach even further. The trend of power-efficient chips has already changed the notebook, desktop, and server markets. Advanced Micro Devices (AMD) hasÂ cited power efficiencyÂ for the reason that its Opteron server processors have outsold chips from Intel in recent months, and Intel says its new Core 2 Duo chips will alsoÂ use power efficiencyÂ to win back that market share. IBM's 750 CL is a 32-bit chip running at 400MHz to 1GHz, and is intended for high-performance embedded applications, including consumer electronics, storage and imaging. The 970GX supports both 32-bit and 64-bit applications running from 1.2GHz to 2.5GHz, making it appropriate for applications in high-bandwidth data processing or algorithmic computation. IBM also announced a roadmap of future products to improve power draw. Its CPC965 will act as a companion chip to the PowerPC 970 series, providing more efficient I/O connectivity. Its 460S is a 32-bit, synthesizable core with variable cache sizes, and its 464FP H90 and 464H90 are application specific integrated circuits (ASICs) that can be manufactured either by IBM or by its partners Chartered Semiconductor and Samsung Electronics. The 464H90 will launch by the end of 2006, while the other three cores ship in the first quarter of 2007. The PowerPC 750CL and PowerPC 970GX are available Tuesday.
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The latest road map change involves two of AMD's quad-core chips for desktops, and will result in the company focusing on triple-core chips and energy-efficient quad-cores in the first quarter.
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AMD has introduced the latest additions to the company's Opteron line, boosting performance of the multi-processor power plants for X86 servers and workstations.
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In an effort to help enterprise users get a handle on power and heat issues associated with new server designs that pack more processing punch in smaller spaces, Advanced Micro Devices on Monday announced that systems built with its 32/64-bit Opteron
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IBM Corp. and Advanced Micro Devices Inc. (AMD) have tacked a three-year extension onto their December 2002 collaboration agreement that could see the two companies work on chip-making technologies based on a 32 nanometer process. The agreement was set to expire at the end of 2005, but now extends until Dec. 31, 2008.
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Advanced Micro Devices and IBM have collaborated on new strained silicon technology, which stands to boost transistor speed. In a statement ahead of the IEEE International Electron Devices Meeting in San Francisco