JBlend(TM) Supports Texas Instruments OMAP3430 in TI Booth at 3GSM World Congress 2007
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Aplix Corporation (TSE: 3727) announced today that the company's JBlend(TM) Java(TM) platform supports the new OMAP3430 multimedia application processor from Texas Instruments Incorporated (TI).
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Texas Instruments Inc , the  world's top mobile phone chip maker, said on Thursday it  expects global sales for analog chips to double over the next  seven years, fuelled by growing demand for consumer  electronics.
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SAN JOSE, CALIFORNIA - Transmeta Corp.'s 90-nanometer Efficeon processor is ready for partners to use in ultraportable notebooks, thin clients, and embedded designs, the company announced Tuesday at the Fall Processor Forum.
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Seamless Wi-Fi, Inc. (OTCBB: SLWF) subsidiary Seamless Peer 2 Peer, Inc. today announced today that Phenom(TM) Release 3.0 was successfully beta tested by US Global Nanospace, Inc.
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(InfoWorld) - As Intel Corp. and Advanced Micro Devices Inc. (AMD) race toward smaller, faster chips, the fierce competition is taking its toll as both companies struggle to maintain profit margins by using more efficient manufacturing. At the tiny scale of 45-nanometer transistors and wires, a single speck of dust on a 300-millimeter silicon wafer can destroy an entire processor. Lower manufacturing yields cut into a company's profit margin, reducing the number of functional chips they can sell from each wafer. "As an industry, we're running out of gas at 45-nanometer geometry," said Nick Kepler, vice president of logic technology development for AMD. "We've been unable to scale the size as much as we used to because of leakage. We're still putting transistors closer together, but not shrinking the gates. So geometry shrinks can hurt you now, which they haven't in the past." One problem is that 65-nm and 45-nm chip components have shrunk so far that they are now smaller than the wavelength of the light used to carve those features onto silicon chips. To fight that trend,Â AMD and IBM Corp. said they will use three new technologies to boost manufacturing efficiency. By the second half of 2008, AMD expects to be producing 45-nm chips using immersion lithography, ultra-low-k interconnect dielectrics, and enhanced transistor strain. The companies made the announcement at the International Electron Device Meeting in San Francisco. By inserting liquid instead of air between the projection lens and the wafer, AMD and IBM can reduce the wavelength of the light, giving them a 40 percent gain in resolution compared to dry lithography and allowing them to sell a higher percentage of the hundreds of chips on every wafer, Kepler said. Likewise, IBM plans to produce 65-nm server chips by the second half of 2007, then shrink both server and gaming chips to 45-nm at some point in the future, said Gary Patton, vice president of technology development for IBM's semiconductor research and development center. AMD and IBM have cooperated on chip development since 2003, and last year extended their contract through 2011 to reach the 32-nm and 22-nm chip generations. In response, Intel says that it beat AMD to the market with 65-nm chip sales by more than a year, andÂ has already begun producing samples of its 45-nm "Penryn" quad-core chipÂ for notebooks, desktops and servers. Intel plans to ship those chips in the second half of 2007. Even if AMD improves its manufacturing, Intel is poised to continue its lead in shrinking chip geometries because it has shorter gate lengths and SRAM (static RAM) cell sizes, said Rob Willoner, a technology analyst with Intel's technology and manufacturing group. "People have different meanings when they talk about the 65-nm process. There's not an industry standard," he said. AMD's Opteron chip was a commercial success because its excellent design compensated for poor dimensions at the 90-nm scale, he said. Chips with a greater cache of local memory stored in SRAM cells can avoid the time-intensive process of retrieving data from external sources. At the same conference in San Francisco this week, Intel announced plans to use "floating-body cells" to further increase the amount of on-chip memory, according to published reports. Despite the manufacturing challenges, chip companies continue to build smaller features because of the tremendous performance benefits. By shrinking from 90 nm to 65 nm, Intel chips have double the transistor density while reducing leakage five-fold (at constant performance) and requiring 30 percent less switching power. Â
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Smartphone users will be able to watch broadband television and snap high-resolution photos on their handsets in 2007, thanks to new processor and memory chips launched at the 3GSM World Congress in Barcelona on Monday.
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Extended collaboration could result in chips built on 32-nanometer technology.
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Texas Instruments Inc., the world's largest maker of chips used in cellular phones, expects third-quarter earnings to come in on the higher end of a range it had previously forecast.
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Sun Microsystems has tapped Taiwan Semiconductor Manufacturing (TSMC) to manufacture its latest UltraSparc processors, Sun said Tuesday.The Taiwanese company will also collaborate with Sun in the OpenSparc program to expand research on the processors in Taiwan. The two companies plan to expand the university outreach program in Taiwan, as well as offer OpenSparc technology to other TSMC customers.TSMC will manufacture UltraSparc processors using its 45-nanometer production technology, as well as future generations of the UltraSparc, Sun said to a statement. Texas Instruments, Sun&#39;s current UltraSparc partner, will continue to test and package the processors.Sun tapped TSMC for production because of its lower costs, in addition to its advanced technology, Sun said. The companies are already working to make the transition to TSMC from TI as fast as possible, Sun added.TSMC is the world&#39;s largest contract chip maker.The term 45-nanometer refers to making chips with transistors and other components as tiny as 45nm, enabling them to be smaller, more powerful and energy-efficient. The nanometer term describes the size of the smallest feature that can be manufactured on a single chip. There are about three to six atoms in a nanometer and there are a billion nanometers in a meter.TSMC has said that some types of chips made using 45nm technology are generally 40 percent smaller than the slightly older 65nm size, use less power, and have 40 percent greater functionality.Currently, most chips are still made using technology 90nm and larger, but the move to smaller sizes is increasing, led by high end chips such as DRAM (dynamic RAM), microprocessors, core logic chip sets, and graphics processors. Intel, the world&#39;s largest chip maker, was first to mass produce chips using 45nm technology.The move to developing smaller chip manufacturing technology is crucial to meet user demand for ever smaller devices that can do more, such as mobile phones with built-in PDA (personal digital assistant) and camera functions, and digital music players. Chip makers can also increase output using the smaller technology.Sun has established six major universities as OpenSparc Technology Centers of Excellence so far, all of them in the U.S. The schools include the University of California, Santa Cruz; University of Texas, Austin; University of Michigan, Ann Arbor; University of Illinois, Urbana-Champaign; Stanford University; and Carnegie Mellon University. The universities must sign a two-year commitment to execute chip design research and course work based on Sun&#39;s chip multi-threading (CMT) design.If a Taiwanese university is chosen to participate as an OpenSparc Technology Center of Excellence, it will be the first outside the U.S.
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Supermicro Computer, Tyan Computer and Uniwide Technologies are showing Barcelona-based servers at this week's trade show in Taipei.
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For several years people have been talking about the idea of miniaturizing a projector so that it&#39;s small enough to fit inside a cell phone or digital camera. Now it&#39;s finally been done, and 3M is demonstrating a prototype of such a device at this year&#39;s International Consumer Electronics Show.The mobile projector is about a centimeter thick and about 4 centimeters tall by 3 centimeters wide -- small enough to fit inside portable devices like cell phones, PDAs, or a digital still camera, said Todd Rutherford, product development specialist with 3M&#39;s optical systems division.It uses an LED as the light source and can project a VGA resolution (640 pixels by 480 pixels) image through a lens that&#39;s about a centimeter in diameter.3M is demonstrating the projector at CES built into a small handheld device that runs video from flash memory. The image projected onto walls or other light surfaces was good enough and easy enough to see over a distance of about half a meter, although it suffered over greater distances due to the bright lights of the show floor.The demo attracted a lot of attention and a constant stream of show attendees, many of whom had badges identifying them as employees of mobile phone makers or network operators.3M is already working with companies interested in embedding the projector in devices, and the first products should be out in early 2008, said Rutherford. He wouldn&#39;t identify the companies or the applications but said that they are mobile consumer electronics products.
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(InfoWorld) - Texas InstrumentsÂ (TI) will develop chips for low-power devices based on a new short-range wireless Bluetooth specification, the company said Tuesday. The move comes on the heals of aÂ decision by NokiaÂ earlier this month to roll its low-power Wibree technology into the new ultra low-power (ULP) Bluetooth specification. While Bluetooth has been used mostly to connect larger devices such as headsets, keyboards and mouses to stereos and PCs, the new ultra low-power specification aims to connect much smaller button-cell battery-powered devices, like watches or sensors attached to a user's body. ULP Bluetooth uses the same 2.4GHz frequency as Bluetooth. ULP Bluetooth will have a range up to 10 meters (33 feet), similar to the Bluetooth Class 2 specification, which requires more energy. A button-cell battery powered device, equipped with the technology, will have an average operating life of one year and transmit data at a speed up to 1Mbps High-power Bluetooth Class 3 has a range up to 100 meters. TI already produces chips for Bluetooth devices as well as devices based on the ZigBee ultra low-power specification. The chip maker views ULP Bluetooth and ZigBee as "complementary" technologies. ZigBee, for instance, is a mesh networking technology designed to support thousands of nodes with some restrictions on quality of service and latency, according to the ZigBee Web site. By comparison, ULP Bluetooth is an ad hoc networking technology that links a smaller number of nodes to devices with high quality of service and low latency. TI will develop chips for both types of ULP Bluetooth implementations: a single-mode implementation for watches, sensors and other tiny devices to communicate with each other; and a dual-mode implementation to communicate with both single-mode and traditional Bluetooth devices, such as handsets. Pricing and product availability details were not disclosed. Â
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3M is demonstrates a prototype of such a device at this year's International Consumer Electronics Show.
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70-megabit memory chip with 35-nanometer transistors is due out in 2005
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A tiny, fully functional, 70-megabit static random access memory computer chip crammed with more than 500 million transistors has been developed by researchers at Intel Corp.
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Blog: The graphics chipmaker has a new lineup of chips that can be plugged into servers or workstations to boost the performance of scientific computing applications.
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Safend, an international provider of endpoint i