NXP Launches Fail-Safe System Basis Chips for Cars
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Semiconductor company NXP has said that it has launched one of the world's first fail-safe CAN-LIN System Basis Chips (SBCs) with integrated diagnostics in order to raise the standards for in-vehicle networking.
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AMD chips in Los Alamos lab's Roadrunner system to be augmented with the PlayStation's processing brains.
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An in-car satellite radio and multimedia system that could use out-of-date satellites is unveiled.
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In an advance that could lead to lighter spacecraft and smarter cars, researchers have developed a new technique for producing a high-quality semiconductor that's much more resistant to extreme conditions than the silicon found in most of today's electronics.
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"Supercomputer on a chip" expected to power Sony's PlayStation 3.
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New PCs will ship with a chip designed to thwart hackers--a hardware approach that's said to be safer than software.
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National Semiconductor has released its Safekeeper Trusted Input/Output chip, which stores passwords, digital certificates and encryption keys on PCs.
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In an advance that could lead to lighter spacecraft and smarter cars, researchers have developed a new technique for producing a high-quality computer chip that is much more resistant to extreme conditions than the silicon found in most of today&#39;s
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HONG KONG, March 5 /Xinhua-PRNewswire-FirstCall/ -- Texas Instruments, NXP and Apexone were among the 24 semiconductor companies that won Global Sources'  Annual Creativity in Electronics (ACE) Awards in mainland China.
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Details of the chip designed to power Sony's PlayStation 3 console will be released on Monday.
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Company puts on a demonstration of promised 'Barcelona' quad-core Opteron chip.
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New sensor technology is not limited to tracking mileage.
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In an advance that could lead to lighter spacecraft and smarter cars, researchers have developed a new technique for producing a high-quality semiconductor that's much more resistant to extreme conditions than the silicon found in most of today's electronics.    Devices built with the rugged material would not require cooling and other protections that add size, weight and cost to traditional silicon electronics in power systems, jet engines, rockets, wireless transmitters and other equipment exposed to harsh environments...
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Upcoming chip set will support 802.11a, b, and g networks.
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Sony and NXP Semiconductors have reached basic agreement on forming a joint venture to develop, manufacture and sell chips that combine Sony's Felica and Philips' Mifare contactless smartcard platforms. NXP wasÂ spun off from PhilipsÂ in Sept. this year.
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Implemented using Texas Instruments&#39; 90 nanometer process technology, UltraSPARC IV+ will double the application throughput of the existing UltraSPARC IV through expanded caches and buffers, a better branch prediction mechanism, augmented prefetching
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Cool computing in the cloud In 2002, a couple of hardware geeks thrust a crazy, fresh idea on the computing community. Chris Hipp, a co-founder of blade maker RLX, and Wu-chun Feng, then a researcher at Los Alamos National Laboratory, concocted a very powerful cluster with servers based on laptop chips from Transmeta. The cluster failed to outperform similar Xeon-based systems, but it could run in a desert warehouse with no special cooling and with less failures than other Los Alamos boxes protected by very expensive air conditioning systems.â¦