Sony, IBM, and Toshiba Reveal Additional Details on Cell Chip
556058
Initial versions of PlayStation 3 chip will not be produced with a cutting-edge chip-making technology.
205811
TOKYO - IBM, Sony and Toshiba on Monday announced the first technical details of the widely-anticipated &quot;Cell&quot; processor, also known as a &quot;supercomputer on a chip,&quot; with Power architecture at its heart.
90099
Sony revealed new details Monday on the chip that will power the next version of its PlayStation video game machine and said development is on track to deliver products based on the chip next year.
589659
The Food and Drug Administration gives doctors the go-ahead to implant radio frequency microchips in patients. When scanned, the chips will release patients' medical information to doctors, speeding care.
583742
Chip maker wants you to know about the benefits of a wireless network.
711264
Impacted with Chartered and Samsung IBM is teaming up with four other chipmakers to develop manufacturing technologies for semiconductors that shrink the average circuit feature to 32 nanometers. The alliance, which is aimed at containing the spiraling cost of building bleeding-edge chips, also involves Chartered Semiconductor, Samsung Electronics, Infineon Technologies and Freescale Semiconductor.â¦
511718
Matrix Semiconductor's memory chips have several layers of transistors rather than a single plane.
47918
IBM IBM.N, Sony Corp. 6758.T and  Toshiba Corp. 6502.T on Monday revealed their plans for the  powerful new "Cell" processor the three are jointly producing  to run next-generation computers, game consoles and  televisions.
227352
Watch out, Nvidia, here comes... er... SpursEngine Toshiba will next week formally announce a processor based on the Cell chip that sits inside each Sony PlayStation 3 games console. The new CPU will be pitched not only at consumer electronics kit but set head-to-head with today's PC and Mac graphics chips.â¦
676340
IBM is the first PC manufacturer to use a National Semiconductor chip that stores a PC&#39;s identity in silicon to avert hackers by safeguarding passwords and other sensitive identity information.
577956
Toshiba Corp (6502.T) said on Tuesday it  would join a group led by International Business Machines Corp   to develop system chips using 32-nanometre circuitry,  as chip makers increasingly team up to cut development costs.
505545
The update reveals a number of details about the device, including its use of a 620MHz ARM1176JZF processor.
719369
Technical details of the new low-power mobile CPU, expected to ship this year, are being released at a chip conference this week.
198221
(InfoWorld) - IBMÂ is pulling out the heavy artillery in its quest to build custom chips for both telephony backbone and handheld wireless devices, announcing a processor family built with silicon-on-insulator (SOI) technology that is usually reserved for server processors. By borrowing SOI technology from its line of Power server chips -- includingÂ the top-shelf Power6Â -- IBM will achieve a 30 percent performance gain compared to chips using standard CMOS (complementary metal oxide semiconductor) technology, the company said Tuesday. And by building it on a scale of 45-nanometer feature sizes, IBM will achieve higher performance than comparable 65nm chips. IBM will launch this Cu-45HP (high performance) custom chip in early 2008, intended for manufacturers of switches and routers as well as cellphones and portable gaming systems. IBM will design a customized version of the ASIC (application specific integrated circuit) for each new client platform, said Bernard Meyerson, an IBM fellow and chief technology officer for IBM's Systems and Technology Group. The company already builds ASICs for the telephony market, but the new design will allow it to create more powerful designs in less time and at lower cost, he said. To boost power-efficiency, IBM is using 45-nm architecture embedded DRAM (dynamic RAM) instead of SRAM (static RAM) in the chip. Although DRAM has three to four times more memory density than SRAM, the company has never before used it for on-chip data storage because it is "pathetically slow," Meyerson said. IBM solved that problem with a recent advance that improves DRAM read/write data access speeds. Chips run faster and use less electricity when they use data stored on the processor itself instead of fetching that data from another location on the circuit board, he said. Once it launches the new chip, IBM expects to quickly reach full manufacturing capacity. Although the chip uses a new combination of technologies, IBM already builds processors with each of the components, such as the SOI-based processors it makes for gaming consoles including Sony Computer Entertainment's PlayStation 3, Microsoft's Xbox 360, and Nintendo's Wii. Despite the new features, IBM is announcing the Cu-45HP at a challenging time in the global chip market. Worldwide sales of semiconductors reached $19.9 billion in April, showing a decline from March as average selling prices continued to drop, according to a report released Monday by the Semiconductor Industry Association (SIA). From January through April, sales were down by nearly 2 percent from the same period of 2006, the report said. The revenue slump occurred because prices have sunk faster than a modest rise in demand for consumer electronics. That consumer demand has bolstered the number of unit shipments in the market, but chip makers are collecting less money because of tumbling prices for many types of chips, including microprocessors, DRAMs and NAND flash, according to the SIA. Also on Tuesday, IBM announced new digital and analog semiconductors for mobile handsets and other wireless products. They include the SiGe BiCMOS 5PAe, a silicon-germanium-based analog product for making efficient power amplifiers in cell phones and WiMAX applications, the SiGe BiCMOS 6WL, an entry-level version of the company's existing technology for high-volume consumer electronics including cell phones and GPS (global positioning system) devices, and the CMOS 11LP, a product design to improve power efficiency in handset design. IBM is selling the 6WL design kits now, and plans to launch the other two products later in 2007. Â
21719
Some details of the highly-anticipated advanced microprocessor, code-named Cell, which is expected to power the PlayStation 3, have been released by the three firms responsible for the chip&#39;s development - IBM, Sony and Toshiba.
203010
Engineers from IBM, AMD, Sony and Toshiba have developed a strained silicon transistor technology aimed at improving processor performance and power efficiency with up to a 24 percent transistor speed increase.
550774
What it's doing with the PS3 processor CES Toshiba used the Consumer Electronics Show (CES) to explain why it plans to incorporate the PlayStation 3's Cell processor into future LCD TV products.â¦