Breakthrough could provide chips with everything
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One of the last frontiers of semiconductor technology - environments where electronic devices have to run at high power, in fierce heat or at lethal doses of radiation - may be about to fall.
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Chipmaker to focus on technology and features instead of megahertz.
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In an advance that could lead to lighter spacecraft and smarter cars, researchers have developed a new technique for producing a high-quality semiconductor that&#39;s much more resistant to extreme conditions than the silicon found in most of today&#39;s
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Researchers say they've created a nifty optics-on-a-chip device that overcomes a major obstacle in harnessing the full power and speed of light waves. By the Associated Press.
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Chipmaker announces new chipset and reference design for consumer devices and PCs.
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IBM (Quote, Chart) and AMD (Quote, Chart) have devised a new silicon transistor technology they claim will boost the speeds of single- and dual-core chips.
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In an advance that could lead to lighter spacecraft and smarter cars, researchers have developed a new technique for producing a high-quality semiconductor that's much more resistant to extreme conditions than the silicon found in most of today's electronics.    Devices built with the rugged material would not require cooling and other protections that add size, weight and cost to traditional silicon electronics in power systems, jet engines, rockets, wireless transmitters and other equipment exposed to harsh environments...
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Powerful computer processor will be modified for mobile devices.
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(InfoWorld) - Researchers from Intel and the University of California at Santa Barbara have found a way to build low-cost "laser chips" that could eventually shuttle data around PCs at much higher speeds than today's copper wire interconnects. The researchers combined the properties of a compound semiconductor material called indium phosphide, which emits light constantly, and silicon, which can be used to amplify and direct that light. They sandwiched the materials together to create a single device that can be manufactured using standard chip-making techniques. The breakthrough, announced Monday, is significant because it could help the interconnect technologies that carry data between components in PCs and servers to keep pace with the rapid advances in processing power of the chips themselves, the researchers said. "This could bring low-cost, terabit-level optical 'data pipes' inside future computers and help make possible a new era of high-performance computing applications," said Mario Paniccia, director of Intel's Photonics Technology Lab, in a statement. The work may be several years away from commercialization, but the researchers expect eventually to be able to put dozens or even hundreds of lasers on a single chip, they said. Indium phosphide is already widely used to make lasers for fiber optic networks, but the cost of assembling and aligning the lasers makes them too expensive for the high-volume PC business. Silicon, on the other hand, can amplify and control light and could be used more affordably, but it is not an efficient generator of light itself. The researchers figured out a way to combine the two materials to build a "hybrid silicon laser" that can be manufactured using Intel's standard manufacturing techniques, keeping costs relatively low. To make the silicon laser they created a thin oxide layer roughly 25 atoms thick on the surface of each material. They then heated the oxide and pressed the two layers together, forming a single chip with a "glass glue" between them. Applying a voltage to the device generates light from the indium phosphide, which passes through the joining layer to be guided and controlled by the silicon. The laser light can send data between computer components at extremely high speed. This can be done using a "silicon optical modulator," which effectively turns the laser beam on and off at very high speeds to represent the 1s and 0s of computer code. Intel has already demonstrated a silicon modulator that can transmit data at up to 10Gb per second. Figuring out how to make the hybrid silicon laser was the last big barrier to using silicon-based optical devices in computers and data centers, the researchers said.
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The chip unveiled at IDF works, but there are a lot of hurdles to overcome before an 80-core chip shows up in a living room.
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A major milestone in microchip production is achieved allowing smaller and higher performance chips.
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The chipmaker appears to have met its most recent deadline for production of the smaller-featured chips.
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A chip the size of a fingernail and capable of more than a trillion calculations per second is unveiled by Intel.
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Chips based on a new architecture known as Isaiah  could help little-known Via Technologies gain some ground in the industry.
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Processors offer significant power savings, chip maker says.
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Intel said it was already starting to explore options such as carbon nanotubes and nanowires. Such materials will be needed to take chips below the 10 nanometer size, which is expected to occur early in the next decade.
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Developments in silicon carbide wafers may lead to a new world of fast, robust electronics.