IBM, AMD speed chips by straining silicon wafers
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Researchers at IBM and Advanced Micro Devices have improved a chip-making technology called strained silicon, boosting semiconductor performance at a time when such
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Chip maker plans for smaller, faster, less power-hungry processors.
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Foundry partner gears up for second-generation 90nm Efficeons
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SAN JOSE, CALIFORNIA - The days of relying on shrinking transistors to achieve performance gains are over, and the chip industry needs to enter a new era of innovation where system-level features are just as important as thinner transistor gates, said IBM Corp.'s Bernie Meyerson in a keynote address at the Fall Processor Forum Tuesday.
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AMD and IBM announced a collaborative breakthrough in processor technology today, marking the first use of two new techniques that advance speed and performance without requiring more power.
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Advanced Micro Devices and IBM will work together to devise chip-manufacturing technology for three additional years, a deal that will bring about a quarter of a billion to IBM over four years and give AMD access to cutting-edge chip inventions.
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SAN JOSE, Calif. - Despite an apparent slowdown in the IC market, IBM Corp. plans to boost the wafer output within its 300-mm fab over the next quarter, according to the company on Monday (Oct. 18).
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Researchers at IBM and AMD have improved a chip-making technology called strained silicon. Their announcement, of a new and unique strained silicon transistor technology, is aimed at improving processor performance and power efficiency.
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Advanced Micro Devices has begun to incorporate a form of strained silicon into its chips, a design twist that will let the company increase the performance of its processors.
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A breakthrough in the way scientists make crystals could lead to a replacement for silicon in chips for devices.
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IBM and Advanced Micro Devices (AMD) are jointly developing a new method for implementing strained silicon technology. to improve performance on processors from both companies as early as next year.
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In an advance that could lead to lighter spacecraft and smarter cars, researchers have developed a new technique for producing a high-quality computer chip that is much more resistant to extreme conditions than the silicon found in most of today&#39;s
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IBM and AMD have jointly developed a new method for implementing strained silicon technology on both positive and negative transistors, a technique they said could improve transistor speeds by as much as 24%.
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Researchers at IBM  and Advanced Micro Devices Inc.  have improved a chip-making technology called strained silicon, boosting  semiconductor performance at a time when such gains are increasingly hard to come by, the companies said on Sunday.
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Advanced Micro Devices (AMD) and International Business Machines (IBM) have developed a new technology that they claim will deliver higher performance margins, from their latest microprocessors, with dual stress liner technology.
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IBMÂ has successfully demonstrated a new technique for improving transistor performance that will help the company build smaller, more powerful chips in the next decade, company researchers said Monday.
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Companies will use strained silicon to boost transistor speed.