AMD&#39;s Mobile Sempron Chips Away at Centrino
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The AMD processor, which is designed to compete with Intel&#39;s high-end Centrino chips, offers extra protection against the spread of malicious viruses when enabled by Microsoft Windows XP SP2.
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Intel Pentium M processors, along with Intel 855 chipset family and the Intel PRO/Wireless Network Connection family, are key components of Intel Centrino mobile technology -- Intel&#39;s best technology for mobile computing.
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After months of delays, Advanced Micro Devices Inc.&#39;s latest processor, a quad-core server chip called Barcelona, is at last expected to hit the market Monday.
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Via Technologies is not likely to ship its supersmall&#160;Mobile ITX motherboard, aimed at ultramobile PCs (UMPCs) and other light portable devices, in production volume until next year, company officials said here at the CES show Monday.The company attracted industry attention when it unveiled the board at Computex in Taipei last June, declaring that it would find its way into markets this year.But &quot;manufacturability issues&quot; will likely prevent the board from being used in commercially launched devices this year, according to Alp Sezen, a sales director for Via based in Fremont, California. Via expects to announce the Mobile ITX production schedule at this year&#39;s Computex, and will probably just manage to ship sample boards by the end of the fourth quarter, he said.&quot;It&#39;s normal to take about a year between announcing a board to production,&quot; he said. He acknowledged, however, that ultimately in the case of the Mobile ITX, the time between its unveiling and production is going to be more than 18 months.Like prototypes running last year, current Mobile ITX boards use 1GHZ CZ-M ULV (ultra low voltage processors) and CX700 chip sets. The board measures 7.5 centimeters by 4.5 cm -- smaller than a credit card -- and to get it that small, the spaces between the pins underneath the processor need to be shrunk to 0.5 millimeters from the current 1.0 millimeters in the company&#39;s current Pico ITX board, Sezen said.It&#39;s not easy to do this and ensure more than 90 percent of the boards coming off production lines are error free, Sezen said.Chip packaging technology needs to improve, he added. Via is a fabless chip developer and, on its own, faces difficulties developing new, cost-effective packaging technologies.In a sense, Via is dependent on Intel ramping up volume of new generation, 45-nanometer process chips. As Intel does so, new surface-mount technology for chips will be developed that can also be used to manufacture the Via Mobile ITX boards.Although the Mobile ITX is not likely to appear in UMPCs and other light portable devices until next year, the reduced package chip set incorporated into the board will likely be used in com modules for embedded systems by the end of this year, Sezen said. A manufacturer for these embedded systems is likely to make a public announcement this month, he said.Some would-be makers of new lightweight mobile devices, however, are chomping at the bit to get their hands on the new Via board. The MTube project, a research and development project sponsored by the Taiwan government&#39;s Science and Technology Group (STAG), was showing off a Linux-based, prototype Mobile Internet Device (MID) that incorporates the Mobile ITX board and measures 3.3 by 3.3 by 0.8 inches. It sported a 2.8-inch VGA touch screen and supports full rate video playback.The project wants to spin off from STAG and deliver a commercially available product as soon as it can get its hands on a motherboad with the specs that would make it viable, according to H.T. Kung, the project&#39;s advisor. However, to date, neither Via nor Intel could promise to deliver a commercially usable board within that timeframe, he said.&#160;
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With the 3GSM World Congress winding down, and with global broadband technology leaders Vodafone, Sierra Wireless, and Novatel Wireless all having demonstrated HSDPA and complementary HSUPA (for uplinks) cards and adapters apparently to very receptive audiences, Nokia decided this morning that its investment in a technology alliance with Intel to develop HSDPA chips for future Centrino Duo notebook computers may not pay off after all.
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&quot;Thin and light&quot; is the order of the day in enterprise mobile computing, and road warriors have had the benefit of Intel&#39;s Centrino platform, which has allowed for some featherweight notebook offerings of late.
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Sunnyvale-based computer chip maker Advanced Micro Devices, Inc., says it&#39;s shipped its first low-power Mobile AMD Athlon 64 processors made with its new 90 nanometer (nm) manufacturing process.
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Advanced Micro Devices on Tuesday said it has begun shipping a 3700+ mobile Athlon 64 processor. The chip maker also confirmed it has started shipping processors on its 90-nanometer manufacturing process for revenue.
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LAS VEGAS -- Advanced Micro Devices (AMD) is expected to unveil Turion, its new brand for mobile processors in thin-and-light notebooks, on Monday, company executives said this week at the International Consumer Electronics Show (CES).ADVERTISEMENTReducing the Total Cost of OwnershipLearn how to reduce the total coast of ownership in enterprise data management in this case study.
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US chipmaker AMD on Monday introduced a faster mobile chip, Athlon 64 processor 3000+, for thin and light notebook computers. The new chip enables a powerful 32-bit computing
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Single-core Athlons for the chop sooner, it's claimed AMD looks set to introduce Socket AM3 processors in the second half of 2008, reports coming out of Asia suggest. Sooner, though, it will begin phasing out single-core Athlon-branded chips, the moles also allege.â¦
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AMD has released the Mobile AMD Sempron processor 3000+ &#39;for Thin and Light Notebooks&#39;. The low-power processor is aimed at entry-level notebooks, as opposed to the 3000+ Mobile AMD Sempron Processor for Full-Size Notebooks.
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AMD amplia la propria gamma di processori mobile a basso consumo, con il lancio di Mobile AMD Athlonâ¢64 3000+ particolarmente dedicato ai notebook &#39;thin-and-light&#39; che assicura prestazioni a 32 bit di altissimo livello.
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Future Opteron processors will have power management technology from AMD&#39;s laptop and desktop systems, the company has announced.
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Count 'em... How many new and updated 45nm mobile microprocessors is Intel planning to launch alongside 'Montevina', the next generation of its Centrino laptop platform? It's going to launch 15, industry insiders claim. Count 'em...â¦
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InfoWorld - Just weeks before launching its new Centrino notebook platform, Intel&#160;said Wednesday it had cancelled plans to provide wireless access with an HSDPA (high speed downlink packet access) module built by Nokia.
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SAN FRANCISCO - Further pitting itself against Intel Corp.'s Pentium-M offerings, Advanced Micro Devices Inc. (AMD) on Monday expanded its lineup of mobile Athlon 64-bit processors.