BASF, IBM team up in chip venture
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BASF, the world&#39;s leading chemicals maker, said on Friday that it had agreed with US computer giant IBM jointly to develop electronic materials for use in the manufacturing of integrated circuits.
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IBM  and Taiwan's top chip design  firm Mediatek Inc  said on Monday they are jointly  launching a research and development project to develop  ultra-fast chipsets to tap into growth in the consumer market.
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IBM and Advanced Micro Devices have come up with a new way of straining silicon in a move that will allow them to make chips with better performance.
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As blue chip companies in developed marketsÂ scramble to outsourceÂ high-cost jobs to low-cost countries, one of the world's biggest technology companies -- IBMÂ -- seems content to keep more than 1,800 highly trained, well-paid IT engineers at its R&D (research and development) lab in BÃ¶blingen, Germany.
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TechWeb - IBM works with Microsoft and other application vendors to expand the use of its hardware in computer clusters and mainframes.
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IBM Corp. and Advanced Micro Devices Inc. (AMD) have tacked a three-year extension onto their December 2002 collaboration agreement that could see the two companies work on chip-making technologies based on a 32 nanometer process. The agreement was set to expire at the end of 2005, but now extends until Dec. 31, 2008.
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Researchers at IBM IBM.N and  Advanced Micro Devices Inc. AMD.N have improved a chip-making  technology called strained silicon, boosting  semiconductor  performance at a time when such gains are increasingly hard to  come by, the companies said on Sunday.
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IBM IBM.N plans to unveil on  Thursday a group of partners to promote its Power computer  chips in a range of electronics, seeking to bring the  community-minded innovation of Linux software to hardware.
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IBM has developed new technology to allow separate chips to be integrated into one, reducing the space needed inside a mobile device to allow more functions.
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IBM today plans to disclose details of a project to put a supercomputer on a chip.
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The application server space is heating up once again as both IBM and BEA Systems tout new versions of their platforms. With its Liquid Computing strategy, San Jose, Calif.
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This morning, IBM confirmed to BetaNews that later this afternoon, its engineers are scheduled to demonstrate their own concept chip, which will utilize an embedded memory architecture for caching.  The company is saying it could double the performance of existing 65 nm processors and future generations by tripling its cache memory capacity and perhaps increase the throughput of that memory tenfold.
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IBM has created a process for repurposing scrap semiconductor wafers.
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SAN JOSE, CALIFORNIA - The days of relying on shrinking transistors to achieve performance gains are over, and the chip industry needs to enter a new era of innovation where system-level features are just as important as thinner transistor gates, said IBM Corp.'s Bernie Meyerson in a keynote address at the Fall Processor Forum Tuesday.
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Astronomy research organization Astron  on Wednesday said it was teaming up with International Business  Machines Corp. , the world's largest technology services  group, to design chips to be used as part of Astron's project  to build a radio astronomy telescope to look at evolving  galaxies.
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Advanced Micro Devices and IBM have collaborated on new strained silicon technology, which stands to boost transistor speed. In a statement ahead of the IEEE International Electron Devices Meeting in San Francisco
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(InfoWorld) - IBM Corp. has taken a large stride in its race with Intel Corp. to make faster, smaller chips by building silicon transistors from a rare combination of metals. Both companies announced in January that they had discovered theÂ special materials needed to build "high-k metal gate" transistors. The special materials are much better insulators than standard silicon dioxide, a crucial trait as chip designers struggle to fit more and more transistors on each microprocessor, since electricity tends to leak from the closely-packed wires, making them hot and inefficient. Until now, neither company had announced the ingredients of this new mix of materials. But IBM researchers said on Monday they had used their Blue Gene supercomputer to model 50 combinations of hafnium dioxide and basic silicon. The company plans to build chips based on the new mixture in 2008. The new material looked good in theory, but IBM engineers had to create simulations of different mixtures to avoid any surprises when they added it to semiconductor production lines, said Alessandro Curioni, a supercomputing expert at IBM's Zurich Research Laboratory. Curioni was one of three authors who published this research in a paper published in the January edition of the scientific journal Physical Review Letters. The team used new algorithms and a Blue Gene/L supercomputer with 4,096 processors to crunch the numbers. The program took about five days to run a simulation for each combination of ingredients, modeling the interaction between individual particles for the 600 atoms in every model. If the researchers had used a typical notebook PC, the 250-day job would have taken them 700 years, he said. Despite IBM's advance, Intel insists it is on track to reach markets first with chips using its own type of "high-k metal gate" transistors. Intel plans to use the technology in a family of 45-nanometer architecture chips scheduled for launch later in 2007, the company said. Â