BASF, IBM team up in chip venture
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BASF, the world&#39;s leading chemicals maker, said on Friday that it had agreed with US computer giant IBM jointly to develop electronic materials for use in the manufacturing of integrated circuits.
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The IBM announcement is being made in collaboration with Intel. Under an agreement reached two years ago, the companies have worked together to design and manufacture blade servers.
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Semiconductor chips that can manage a good bit of their own upkeep are moving closer to reality.
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The project will tap into the power of home PCs to create a virtul supercomputer. By Paul McDougall. As part of a broader effort to spur collaborative research in key industries, IBM on Tuesday launched a project
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As the chip industry heats up, this is the company to watch.
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The Bundesagentur fuer Arbeit (BA), the federal government agency responsible for supporting Germany's labor market, and IBM (NYSE: IBM) today announced an innovative new project to improve the agency's procurement processes.
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IBM  plans to unveil on Thursday a group of partners to promote its Power computer chips in a range of electronics, seeking to bring the community-minded innovation of Linux software to hardware.
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IBM has formed an industry consortium, called Power.org, to open up the process of building Power processors. Power.org is intended to give IBM&#39;s partners better access to the Power technology so that they
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IBM's new chip works in 64-processor servers and contains features to let users cap system power consumption.
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IBM Corp. (NYSE: IBM) and Advanced Micro Devices (NYSE: AMD) said Monday that they have developed a strained silicon transistor technology aimed at
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IBM and Advanced Micro Devices have come up with a new way of straining silicon in a move that will allow them to make chips with better performance.
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IBMÂ and Advanced Micro DevicesÂ (AMD) have jointly developed a new method for implementing strained silicon technology on both positive and negative transistors, the companies said Monday.
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Astronomy research organization Astron  on Wednesday said it was teaming up with International Business  Machines Corp. , the world's largest technology services  group, to design chips to be used as part of Astron's project  to build a radio astronomy telescope to look at evolving  galaxies.
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A new semiconductor alloy jointly developed by IBM and its partners will spur the development of faster and smaller memory chips. The companies say the advancements would lead to smaller chips than currently possible with flash memory.
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Sun to follow? Exclusive AMD has secured yet another major partner win thanks to Opteron. Starting with the Power7 processor, IBM will give up on making its own Unix/RISC box motherboards. Instead, it will plug the Power chips directly into slightly modified Opteron boards in an effort to save money.â¦
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IBM says that it has developed a technique of using &#39;strained germanium&#39; which, it claims, will triple the performance of commercial chips.
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(InfoWorld) - IBM will work with the German chemical company BASF Group to produce a new generation of chips with feature sizes of 32 nanometers, the companies said Friday. The partnership will produce chips scheduled to reach the market in 2010, IBM said. Chips with circuits and other features of 32nm use less electricity and have smaller dimensions than chips built with 45nm or 60nm, allowing vendors of smartphones, notebook PCs, and other electronics to pack more processing power in their products. The two companies hope to create an improved approach to using chemicals in lithography, a method of manufacturing chips by stacking layers of different materials like a cake, then etching away part of each layer to create the tiny components of a microprocessor. Work will begin immediately at IBM's facility in Yorktown Heights, New York, and at BASF's headquarters in Ludwigshafen, Germany, said Ronald Goldblatt, a distinguished engineer and senior manager at IBM Research. BASF already supplies chemicals to many chipmakers, but under the new partnership it will also share its employees and expertise with IBM. Each company will play to its strengths, with most of the synthesis and testing happening at BASF, while prototyping and application work at IBM, Goldblatt said. He declined to comment on whether the deal involved any exchange of money. IBM plans to use the new chemicals across its entire range of products, which include itsÂ Power6 high-end server chipÂ announced on May 21, a variety of ASICs for telephony backbone platforms, and itsÂ Cell Broadband Engine chipÂ used to process high-end graphics data in gaming consoles, including Sony Computer Entertainment's PlayStation 3, Microsoft's Xbox 360, and Nintendo's Wii. The BASF deal marks an expansion of IBM's strategy of collaborating with partners to design new chips instead of doing all the work itself. IBM used the same approach when it created the Cell chip by collaborating with Sony and Toshiba. And on May 23,Â IBM said it would collaborateÂ with a larger group of chipmakers on 32nm semiconductor production technologies. That group includes Chartered Semiconductor Manufacturing, Freescale Semiconductor, Infineon Technologies, and Samsung Electronics. IBM is also using the new deal to ratchet up competition with Intel, which plans to bring its own 32nm architecture chips to market by 2009. The two companies have been locked in an increasingly public race to design faster chips since they both picked the same day in January to issue news releases about advances in "high-k metal gate" technology. That approach employs rare materials to construct smaller, more efficient transistors than the silicon dioxide used in modern chips. Intel insists it leads the industry in that race, with plans to use the new technique to launch its 45nm "Penryn" chip in the fourth quarter of 2007, while IBM and its partner Advanced Micro Devices don't plan to sell 45nm chips until the middle of 2008. Texas Instruments entered the contest as well on June 13, announcing a plan to use high-k materials in 45nm chips, also beginning production in the middle of 2008.