Samsung Makes Smaller MMC Card for Cell Phones
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Thumbnail-sized memory card's maximum capacity will be 128MB.
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Companies are developing MRAM, which could be used in portable electronic devices.
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If mobile phones are getting too small for your fingers or eyes, a Dutch company called Polymer Vision has a unique solution. It announced today a phone with a foldable screen that offers a display larger than the device itself.
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When the sun shines, mobile phone users frequently seek out shade to see their display. Samsung Electronics Co. wants to help solve that problem.
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In a flash, Samsung has unveiled its latest removable storage product, and it&#39;s only a quarter of the size of a standard multimedia memory card.
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Samsung Electronics Co. Ltd. has begun producing a smart card IC (integrated circuit) chip that the company claims contains a larger amount of erasable and programmable memory than those of competitors, it said in a statement on Tuesday.
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Via Technologies is not likely to ship its supersmall&#160;Mobile ITX motherboard, aimed at ultramobile PCs (UMPCs) and other light portable devices, in production volume until next year, company officials said here at the CES show Monday.The company attracted industry attention when it unveiled the board at Computex in Taipei last June, declaring that it would find its way into markets this year.But &quot;manufacturability issues&quot; will likely prevent the board from being used in commercially launched devices this year, according to Alp Sezen, a sales director for Via based in Fremont, California. Via expects to announce the Mobile ITX production schedule at this year&#39;s Computex, and will probably just manage to ship sample boards by the end of the fourth quarter, he said.&quot;It&#39;s normal to take about a year between announcing a board to production,&quot; he said. He acknowledged, however, that ultimately in the case of the Mobile ITX, the time between its unveiling and production is going to be more than 18 months.Like prototypes running last year, current Mobile ITX boards use 1GHZ CZ-M ULV (ultra low voltage processors) and CX700 chip sets. The board measures 7.5 centimeters by 4.5 cm -- smaller than a credit card -- and to get it that small, the spaces between the pins underneath the processor need to be shrunk to 0.5 millimeters from the current 1.0 millimeters in the company&#39;s current Pico ITX board, Sezen said.It&#39;s not easy to do this and ensure more than 90 percent of the boards coming off production lines are error free, Sezen said.Chip packaging technology needs to improve, he added. Via is a fabless chip developer and, on its own, faces difficulties developing new, cost-effective packaging technologies.In a sense, Via is dependent on Intel ramping up volume of new generation, 45-nanometer process chips. As Intel does so, new surface-mount technology for chips will be developed that can also be used to manufacture the Via Mobile ITX boards.Although the Mobile ITX is not likely to appear in UMPCs and other light portable devices until next year, the reduced package chip set incorporated into the board will likely be used in com modules for embedded systems by the end of this year, Sezen said. A manufacturer for these embedded systems is likely to make a public announcement this month, he said.Some would-be makers of new lightweight mobile devices, however, are chomping at the bit to get their hands on the new Via board. The MTube project, a research and development project sponsored by the Taiwan government&#39;s Science and Technology Group (STAG), was showing off a Linux-based, prototype Mobile Internet Device (MID) that incorporates the Mobile ITX board and measures 3.3 by 3.3 by 0.8 inches. It sported a 2.8-inch VGA touch screen and supports full rate video playback.The project wants to spin off from STAG and deliver a commercially available product as soon as it can get its hands on a motherboad with the specs that would make it viable, according to H.T. Kung, the project&#39;s advisor. However, to date, neither Via nor Intel could promise to deliver a commercially usable board within that timeframe, he said.&#160;
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Samsung Electronics has developed ultra-fast 1Gb OneNand Flash memory designed for next-generation mobile phones which it claims boasts a fourfold read speed increase over conventional Nand Flash performance.
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Samsung Electronics Co. Ltd., the world's  third-largest handset maker, said on Tuesday it was launching  the first mobile phone with a stamp-sized hard disc drive this  month that would expand the memory capacity by 15 times.
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Samsung mobile phones look set to double as m-wallets as the mobile phone manufacturer signs a Near Field Communication chip deal with Philips.
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(InfoWorld) - In response to demand for ever-smaller cell phones, STMicroelectronics announced the availability of a new type of memory chip packaging technology on Wednesday. Package-on-Package technology allows certain components to be assembled in a vertical stack, offering space savings to mobile phone makers. The technology is particularly helpful in the construction of high-end mobile phones with high-density memory and complex processor combinations, STMicroelectronics said. Package-on-Package technology also offers manufacturers flexibility in how they combine components and design their products. By employing the technology, manufacturers can also source and test the memory system and logic device separately. The technique can simplify assembly on multimedia mobile phones. A variety of components can employ the Package-on-Package configuration, including NOR Flash and NAND Flash. The Joint Electron Device Engineering Council, the standard-setting body for the semiconductor industry, is currently working on defining a specification for the technology, STMicroelectronics said. Mobile phones support a growing array of functions including video recorders and players, cameras, and music downloads. These capabilities demand increasing memory and processing power, requiring larger components that often boost the size of devices. Mobile phone makers are keen to employ technologies that can help keep the final products small.
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Samsung Electronics Co. on Monday unveiled a new type of memory chip that it said will allow digital devices to work faster by saving new data more quickly.
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(InfoWorld) - Samsung ElectronicsÂ is using a more advanced production method to push graphics memory chips to a higher speed. The company, which is one of the world's biggest chip makers, said Friday it has managed to make GDDR4 (graphics double data rate 4) memory chips that work at 4Gbps. That's two-thirds faster than the current fastest GDDR4 chips generally available, which operate at 2.4Gbps, Samsung said. It managed to make the higher speed chips by using 80 nanometer production technology. A nanometer is a millionth of a millimeter and the measurement refers to the size of the smallest feature on a chip's surface. As these sizes get smaller, chips can be made more compact, use less energy and work at higher speeds. Samsung's first 4Gbps GDDR4 memory will be a 512Mb (64MB) chip. The South Korean company will begin offering sample chips to customers this month and mass production will come later this year.
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Toshiba Corp. (6502.T) will begin  mass-production of microSD memory cards, the world's smallest,  in September, aiming to take market share amid strong demand  for smaller cards, the Nihon Keizai business daily said on  Friday.
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Samsung Electronics Co. Ltd. has developed a pair of chips that can receive and decode four mobile digital TV systems. The chips should make possible smaller portable media players and cell phones that can pick up local broadcasts around the world.
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Samsung MMCmicro It seems that mobile phones will soon be getting yet another new memory storage format, joining a growing field of ever-smaller memory cards.
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(InfoWorld) - Samsung Electronics is sampling a new type of flash memory device that could make it easier for makers of mobile phones and MP3 players to increase the storage capacity of their products. Samsung's moviNAND devices combine a NAND flash memory chip, an MMC (multimedia card) controller, and some firmware into a component that's small enough to be used in the latest portable electronics products, the company said. Samsung has started shipping samples of 1GB and 2GB moviNAND chips to manufacturers and will begin mass producing them later this month. It plans to introduce 512MB and 4GB capacities by the end of this year, it said. MoviNAND solves allows device makers to include a large amount of flash memory in their products while still using a standard serial interface, the company said. "The significance of the MMC interface is that the complexities of the native NAND interface and management are completely abstracted from the [portable device]," Samsung spokesman John Lucas said via e-mail. In addition, the MMC interface performance better than other standard interfaces because it has an 8-bit wide bus, allowing data to be processed at up to 52MB per second, he said. NAND flash has become popular for its ability to store large amounts of data at relatively low cost and to retain that data when devices are switched off. It's used in memory sticks, memory cards and digital music players such as Apple Computer's iPod. Other NAND makers include Toshiba, Hynix Semiconductor, and IM Flash Technologies. It's one of several recent flash memory advancements from Samsung. On Monday the South Korean companyÂ showed off a 32GB NAND flash memory chipÂ built using an advanced, 40-nanometer manufacturing process.