Intel Details Teraflops Chip
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A new computer chip developed by Intel promises to perform calculations as quickly an entire data center, while consuming as much energy as a light bulb. By the Associated Press.
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Never to be left outdone for long, AMD answered Intel's challenge yesterday at a press event in San Francisco, unveiling a system design that, while not a single CPU, makes the case for "teraflop on a budget."  It's a four-processor system that uses a pair of Opterons and a pair of co-opted ATI R600 graphics chips.
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roundup As chip engineers gather in San Francisco, Intel shows off its teraflop chops, and AMD talks pricing pressure and power consumption.
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At ISSCC next week, Intel will reveal details on a new CPU that sounds like Silverthorne--but execs won't confirm.
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Expect more information this week on Tukwila, Intel's upcoming quad-core Itanium processor.
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(InfoWorld) - About half of the work on Intel's recently announced "teraflop research chip" was done in India, highlighting the country's growing importance to Intel's research and development efforts. Researchers in Oregon and Bangalore designed the programmable chip, which crams 80 cores onto a fingernail-size device that draws just 62 watts of power, said Vasantha Erraguntla, engineering manager at the India Research Center. Erraguntla led the 20-person design team in Bangalore that worked on the logic, circuit and physical design of the chip. Intel first discussed the research processor earlier this month, saying it can perform more than a trillion floating point operations per second, or a teraflop. It doesn't plan to bring that particular device to market, but the researchers in Bangalore are now looking at the implications of putting such a powerful processor into a system. The chip has spurred research projects in the areas of cooling, high-bandwidth interconnects and power management, said Vittal Kini, director of the research center, which was set up in 2004 and is the latest addition to the India Development Center in Bangalore. Besides working on the teraflop chip, some 50 researchers there are working on other areas of circuit and systems research. The Development Center is fast emerging as a key research and design location for Intel. The company has about 3,000 staff in India, of which close to 2,900 are in research and development. Indian engineers work on the design of chips and chipsets, reference designs, system software, and packaging technologies, said Sandeep Shah director of the mobility group at the India Development Center. Indian engineers have full ownership of the development of key Intel chips for the server and mobile market, he added.
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SANTA CLARA, Calif., - Intel Corporation has built fully functional SRAM (Static Random Access Memory) chips using 65 nanometer (nm) technology, its next generation high-volume semiconductor manufacturing process.
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Intel, the world&#39;s biggest semiconductor maker, said Monday it built a test chip with a new process that creates faster circuits by packing 10 million transistors into an area the size of the tip of a ballpoint pen.
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Intel will offer a detailed look at a new processor next week during a presentation at the International Solid State Circuits Conference (ISSCC) that should set the stage for an unexpectedly&#160;close battle with Taiwan&#39;s Via Technologies.Intel&#39;s presentation will cover technical details of an unnamed low-power processor that is made using a 45-nanometer process and designed for mobile Internet devices, according to an abstract contained in the ISSCC program. That&#39;s the same general description used by Intel to describe its&#160;upcoming Silverthorne processor.Intel executives declined to confirm whether the ISSCC presentation covers Silverthorne but said the abstract provided an accurate description of the unspecified processor. If the chip described is indeed Silverthorne, the presentation appears set to confirm many rumored details of the chip&#39;s architecture and characteristics.Most importantly, Silverthorne is rumored to be an in-order processor, the same as the processor Intel will detail next week, according to the abstract.In layman&#39;s terms, this means the chip functions like a factory with a single assembly line and is capable of processing one operation at a time. An in-order processor must complete that operation before it can move on to another operation. This is a different chip architecture from that used in Intel&#39;s other processors but it&#39;s the same as Via Technologies&#39; low-power C7 chip, which has proved popular among the portable device makers that are Silverthorne&#39;s target market.The processor that Intel will discuss next week is also a dual-issue processor, just as Silverthorne is rumored to be. This feature -- which Intel is likely to emphasize at ISSCC -- allows two instructions to be issued at a time and should give Silverthorne a performance advantage over the C7, which can issue only one instruction at a time.If these rumored characteristics of Silverthorne are confirmed next week, the stage will be set for an unexpectedly close contest between Intel and&#160;Via&#39;s upcoming low-power Isaiah processors, which are also designed for small, portable computers.Tiny by comparison to Intel and Advanced Micro Devices, Via has nevertheless managed to carve out a comfortable niche selling the inexpensive, low-power C7. Beset by a dying third-party chipset business, Via hopes to become a mainstream processor supplier with its upcoming Isaiah processors, which the company unveiled last week.Unlike the C7 and Silverthorne, Isaiah uses a superscalar, out-of-order processor architecture. This architecture, which is used in high-end chips from Intel and AMD, generally offers better performance than an in-order design and is akin to a factory equipped with multiple assembly lines capable of processing different operations at the time.The performance of Isaiah is further enhanced by being superscalar, or having the ability to process multiple instructions during every clock cycle.Centaur, the Via subsidiary that handles processor design for the company, is confident that Isaiah will outperform Silverthorne, even though an accurate comparison of both chips won&#39;t be possible until the two processors can be benchmarked and assessed by independent observers.Nevertheless, Isaiah looks good on paper. Via chips based on the new architecture will offer 1MB of L2 cache and support a front-side bus running at speeds up to 1.3GHz. By comparison, the chip that Intel will reveal next week has 512KB of cache and a 533MHz front-side bus.But the ISSCC abstract raises as many questions as it appears to answer. For example, it doesn&#39;t specify how many cores the new Intel chip will use and gives no indication for how fast these cores will run.Silverthorne, and arelated processor called Diamondville, are widely expected to be available in single-core and dual-core versions. They are also expected to run at roughly the same clock speeds as the Isaiah chips, will be available in versions running from 400MHz up to 2GHz.&#160;
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Intel have announced that they&#39;ve produced a fully functioning memory chip using 35 nanometer transistors. The breakthrough, etching components that are 30% smaller than current processes, should be delivering
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Intel Corp., the world&#39;s biggest semiconductor maker, said it built a test chip with a new process that creates faster circuits by packing 10 million transistors into an area the size of the tip of a ball-point pen.
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The Apple-based System X supercomputer at Virginia Tech has been upgraded to run at 12.25 teraflops. The system placed third on the list of the world&#39;s most powerful supercomputers last
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Fulfilling a long-time goal, Intel is set to introduce this week its first chipset that supports all three current forms of Wi-Fi, according to sources familiar with the announcement.
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The chipmaker appears to have met its most recent deadline for production of the smaller-featured chips.
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Dual-core processors to be considered single chip, company says.
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The glass-encased room inside Intel Corp.&#039;s microchip factory here, with its shiny, metallic surfaces and frigid air, is a world away from the blistering sun and brown earth outside. An army of robots suspended from the vast ceiling glide from one refrigerator-sized machine to the next. Their cargo: thousands of 12-inch silicon platters that form the raw material for Intel&#039;s most sophisticated computer microprocessor to date.
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Advanced Micro Devices plans to demonstrate its version of a new approach to processor design, with a chip that is expected to offer faster computing and relatively less power consumption.