Toshiba borgs into IBM's 32nm alliance
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Intel stays outside the tent Toshiba confirmed yesterday that it had joined a 32-nanometre chip development group led by IBM and made up of a number of key industry players minus top dog Intel.â¦
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New York, November 29: International Business Machines Corp is set to introduce a new chip to be used in consumer products that it has developed with Sony Corp and Toshiba Corp, the Wall Street Journal reported on Monday.
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Toshiba Corp. (6502.T) said it would buy  microprocessors from Advanced Micro Devices Inc. ,  ending its exclusive ties with Intel Corp.  for the  supply of the brains that run computers, and sending its shares  higher.
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Impacted with Chartered and Samsung IBM is teaming up with four other chipmakers to develop manufacturing technologies for semiconductors that shrink the average circuit feature to 32 nanometers. The alliance, which is aimed at containing the spiraling cost of building bleeding-edge chips, also involves Chartered Semiconductor, Samsung Electronics, Infineon Technologies and Freescale Semiconductor.â¦
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Sony and IBM have introduced the first workstation based on the Cell processor, which they jointly developed in partnership with Toshiba.
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Toshiba president Tadashi Okamura has confirmed that the designs for the "CELL" microprocessor are nearing completion. The CELL is a collaborative effort between IBM, Sony and Toshiba to design a next-generation, grid-enabled multimedia processor.
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IBM, Sony and Toshiba are joining forces to challenge Intel, creating a new computer chip called Cell. The three companies have been working together on Cell since 2001.
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Toshiba Corp said on Tuesday it would join a group led by International Business Machines Corp to develop system chips using 32-nanometre circuitry, as chip makers increasingly team up to cut development costs.
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Toshiba Corp.  said it would buy microprocessors from Advanced Micro Devices Inc. , ending its exclusive ties with Intel Corp.  for the supply of the brains that run computers, and sending its shares higher.
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Toshiba Corp, Japan&#39;s second largest chipmaker, has agreed to start selling a type of semiconductor known as flash memory to Apple Computer Inc, maker of the best-selling iPod digital music player.
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(InfoWorld) - It may be too early to talk plug-and-play but IBMÂ believes it can help businesses of all sizes easily cluster their servers to handle intensive computing workloads. Leveraging its expertise in high-end computing and vertical industry applications, IBM has launched several initiatives to allow small and medium-size businesses (SMBs) and the departments of large enterprises to integrate their servers -- from as few as two to many thousands -- into computing clusters designed for high-performance computing tasks, the company said Wednesday. Initially targeted at the businesses in the life sciences, computer-aided engineering, and finance sectors, IBM will offer preconfigured "snap-together" cluster systems for customers using the company's computers and storage devices. The systems are designed to run on Linux and Microsoft Windows Compute Cluster Server 2003 operating systems and will include networking technology from companies such as Cisco Systems. The collaboration with Microsoft will allow businesses to use parallel processing on clusters to free up client machines from long-running applications. ISVs (independent software vendors) and business partners will receive tools to help them introduce IBM's cluster systems. These include sizing guides with predefined cluster configurations for simple ordering and installation. IBM business partners have access to the company's Cluster Enablement Team for technical questions and advice. For customers, software vendors and business partners running Microsoft cluster servers, IBM has four new benchmarking facilities in Poughkeepsie, New York, Raleigh, North Carolina, Beaverton, Oregon and Montpelier, France. These centers join a network of global Linux benchmark centers. To attract businesses interested in computing clusters, IBM's Deep Computing Capacity on Demand centers will give them access to more than 20,000 processors to test the technology for themselves. IBM offers a range of products that support computing clusters, including its System x, System p and BladeCenter servers, as well as the IBM System Storage and IBM System Cluster 1350.
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(InfoWorld) - IBMÂ is pulling out the heavy artillery in its quest to build custom chips for both telephony backbone and handheld wireless devices, announcing a processor family built with silicon-on-insulator (SOI) technology that is usually reserved for server processors. By borrowing SOI technology from its line of Power server chips -- includingÂ the top-shelf Power6Â -- IBM will achieve a 30 percent performance gain compared to chips using standard CMOS (complementary metal oxide semiconductor) technology, the company said Tuesday. And by building it on a scale of 45-nanometer feature sizes, IBM will achieve higher performance than comparable 65nm chips. IBM will launch this Cu-45HP (high performance) custom chip in early 2008, intended for manufacturers of switches and routers as well as cellphones and portable gaming systems. IBM will design a customized version of the ASIC (application specific integrated circuit) for each new client platform, said Bernard Meyerson, an IBM fellow and chief technology officer for IBM's Systems and Technology Group. The company already builds ASICs for the telephony market, but the new design will allow it to create more powerful designs in less time and at lower cost, he said. To boost power-efficiency, IBM is using 45-nm architecture embedded DRAM (dynamic RAM) instead of SRAM (static RAM) in the chip. Although DRAM has three to four times more memory density than SRAM, the company has never before used it for on-chip data storage because it is "pathetically slow," Meyerson said. IBM solved that problem with a recent advance that improves DRAM read/write data access speeds. Chips run faster and use less electricity when they use data stored on the processor itself instead of fetching that data from another location on the circuit board, he said. Once it launches the new chip, IBM expects to quickly reach full manufacturing capacity. Although the chip uses a new combination of technologies, IBM already builds processors with each of the components, such as the SOI-based processors it makes for gaming consoles including Sony Computer Entertainment's PlayStation 3, Microsoft's Xbox 360, and Nintendo's Wii. Despite the new features, IBM is announcing the Cu-45HP at a challenging time in the global chip market. Worldwide sales of semiconductors reached $19.9 billion in April, showing a decline from March as average selling prices continued to drop, according to a report released Monday by the Semiconductor Industry Association (SIA). From January through April, sales were down by nearly 2 percent from the same period of 2006, the report said. The revenue slump occurred because prices have sunk faster than a modest rise in demand for consumer electronics. That consumer demand has bolstered the number of unit shipments in the market, but chip makers are collecting less money because of tumbling prices for many types of chips, including microprocessors, DRAMs and NAND flash, according to the SIA. Also on Tuesday, IBM announced new digital and analog semiconductors for mobile handsets and other wireless products. They include the SiGe BiCMOS 5PAe, a silicon-germanium-based analog product for making efficient power amplifiers in cell phones and WiMAX applications, the SiGe BiCMOS 6WL, an entry-level version of the company's existing technology for high-volume consumer electronics including cell phones and GPS (global positioning system) devices, and the CMOS 11LP, a product design to improve power efficiency in handset design. IBM is selling the 6WL design kits now, and plans to launch the other two products later in 2007. Â
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Advanced Micro Devices and IBM will work together to devise chip-manufacturing technology for three additional years, a deal that will bring about a quarter of a billion to IBM over four years and give AMD access to cutting-edge chip inventions.
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TOKYO: Toshiba said on Thursday it would make programmable microchips for Xilinx from the first quarter of the 2005 calendar year, in a deal seen helping shield the Japanese firm from fluctuations in global demand.
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(InfoWorld) - Toshiba and Micron TechnologyÂ have settled a number of outstanding lawsuits regarding alleged patent infringement and theft of trade secrets related to computer memory chips. Under terms of an agreement announced Friday, Toshiba will purchase some Micron patents related to semiconductor technology and license patents previously owned by Lexar Media, which wasÂ acquired by MicronÂ earlier this year. Toshiba will pay $288 million to Micron in return for the patents and licenses, Toshiba said. The amount is substantially less than the $465 million inÂ compensation awarded to LexarÂ by a California court in 2005. The payment has been on hold since late last year after Toshiba succeeded in having the damages reconsidered andÂ filed an appealÂ seeking to overturn the original guilty verdict. Earlier this year Lexar raised the stakes by asking the U.S. International Trade Commission toÂ bar the importÂ of some of Toshiba's NAND flash-memory chips and products containing them. The ITC action will now be dismissed, along with others at the U.S. District Court for the Northern District of California and the California Court of Appeals, Toshiba said. Toshiba became business partners with Lexar when it invested $3 million in the company in 1997 and acquired a seat on its board of directors. According to Lexar's original complaint, Toshiba sat on the board for two and a half years and gained access to the company's product plans and technology, while at the same time working with Lexar rival SanDisk. Â
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TOKYO - IBM, Sony and Toshiba on Monday announced the first technical details of the widely-anticipated &quot;Cell&quot; processor, also known as a &quot;supercomputer on a chip,&quot; with Power architecture at its heart.
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In papers presented at the International Solid State Circuits Conference (ISSCC) today, IBM (NYSE: IBM) revealed a first-of-its-kind, on-chip memory technology that features the fastest access times ever recorded in eDRAM (embedded dynamic random access memory).